A comparison of chemical and atmospheric plasma assisted copper plating on carbon fiber reinforced epoxy polymer surfaces

Prysiazhnyi, Vadym; Stupavská, Monika; Ráheľ, Jozef; Kleber, Christoph; Černák, Mirko; Rafailović, Lidija D.

doi:10.1016/j.surfcoat.2014.07.026

Cited by 21 publications

(10 citation statements)

References 12 publications

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“…The diffuse coplanar surface barrier discharge (DCSBD) plasma generator consists of 96% Al2O3 dielectric panels; an electro-insulated pair of comb-like metallic feed electrodes (width, 1.5 mm; gap, 1 mm) placed 0.635 mm underneath its surface was powered by a harmonic voltage of 8 kV rms, 14 kHz, and 300 W input power (Odrášková et al 2008;Novák et al 2012;Prysiazhnyi et al 2014). As a result, cold DCSBD plasma was formed on the dielectric surface, covering an area of 195×80 mm 2 and spreading approximately 0.3 mm outwards into free space ( Figs.…”

Section: Modification By Barrier Plasmamentioning

confidence: 99%

Effect of Barrier Plasma Pre-Treatment on Polyester Films and their Adhesive Properties on Oak Wood

Novák¹,

Sedliacik²,

Gajtanska³

et al. 2016

BioResources

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A barrier plasma, created at atmospheric pressure, was used to improve the surface and adhesive properties of polyester (PES) film with respect to wood using polyurethane adhesives. The modification of PES film surfaces using barrier discharge plasma is attractive for various applications. Plasma pre-treatment initiates and participates in grafting, polymerization, or cross-linking reactions on the PES surface. This method of surface modification is clean, dry, ecological, and very efficient. The enhancement of the wettability of the polyester film was necessary for promoting higher adhesion to wood with water-based adhesives. The treatment of polyester films by barrier plasma led to a considerable increase in the surface free energy of the film and subsequently an increase in the peel strength of the adhesive joint of PES film-oak wood with polyurethane adhesive.

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Section: Modification By Barrier Plasmamentioning

confidence: 99%

Effect of Barrier Plasma Pre-Treatment on Polyester Films and their Adhesive Properties on Oak Wood

Novák¹,

Sedliacik²,

Gajtanska³

et al. 2016

BioResources

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“…Hence, modifications of the morphology and the reactivity of the surface are essential for the adhesion of copper on the polymer. They can be modified chemically and/or physically [7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26]. Physical modifications generate the formation of surface roughness favoring mechanical anchoring, where the geometry of the two parts ensures the cohesion of the assembly [7][8][9]16,22,[24][25][26][27].…”

Section: Introductionmentioning

confidence: 99%

Metallization of carbon fiber reinforced polymers: Chemical kinetics, adhesion, and properties

Addou

Duguet

Bosso

et al. 2016

Surface and Coatings Technology

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In the present study, we investigate different surface pretreatments and their influence on a subsequent surface metallization. A direct liquid injection metalorganic CVD (DLI-MOCVD) process is presented for the low temperature metallization of composites, ultimately aiming at the surface functionalization of 3D parts. The process involves the organometallic precursor Cu(I) hexafluoroacetylacetonate 2-methyl-1-hexene-3-yne (hfac)Cu(MHY). We determine chemical kinetics of the global deposition reaction and show the improvement of the adhesion of the Cu films by applying surface pretreatments that etch and/or activate the surface before deposition. To this purpose, gas phase and wet chemical processes are used. Gas phase pretreatments consist either in the use of a remote microwave plasma, an in situ UV oxidation, or in the deposition of acrylic acid/ethylene plasma buffer layer by using an atmospheric pressure cold plasma jet. The liquid phase pretreatment is based on a commercial series of solutions that includes swelling, oxidation, and neutralization steps. The adhesive strength of the Cu films on poly-epoxy and on carbon fiber/poly-epoxy composite surfaces is specifically investigated by scratch and cross-cut testing, and is correlated with topographical, chemical, and energetic characteristics of the surfaces prior deposition, investigated by interferometry, X-ray photoelectron spectroscopy and wettability measurements through the sessile drop method. Pretreatments result in surface functionalization and topographical changes which significantly increase the surface energy and improve the wettability. In some cases the induced modification of the microstructure of the Cu films is found to be beneficial to the electrical resistivity.

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“…Metallized carbon fiber-reinforced polymer (CFRP) substrates are used in many fields, including aerospace applications. The development of advanced CFRP metallic composites, particularly Cu, Ni, and their alloys realized through an electrochemical deposition process has been a subject of intensive work. , Surface metallization of CFRP yields a conductive surface and brings benefits of both metals and composites, minimizing the amount of metal required for electrostatic discharge and electromagnetic interference–radiofrequency interference shielding and/or protection against lightning strikes and earthing for on-board electronics. Here, we demonstrate a procedure for producing free-standing rGO–metal foils by metallization of nonconductive CFRP substrates modified by rGO.…”

Section: Introductionmentioning

confidence: 99%

New Insights into the Metallization of Graphene-Supported Composite Materials─from 3D Cu-Grown Structures to Free-Standing Electrodeposited Porous Ni Foils

et al. 2022

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The conductivity and the state of the surface of supports are of vital importance for metallization via electrodeposition. In this study, we show that the metallization of a carbon fiber-reinforced polymer (CFRP) can be carried out directly if the intermediate graphene oxide (GO) layer is chemically reduced on the CFRP surface. Notably, this approach utilizing only the chemically reduced GO as a conductive support allows us to obtain insights into the interaction of rGO and the electrodeposited metal. Our study reveals that under the same contact current experimental conditions, the electrodeposition of Cu and Ni on rGO follows significantly different deposition modes, resulting in the formation of three-dimensional (3D) and free-standing metallic foils, respectively. Considering that Ni adsorption energy is larger than Ni cohesive energy, it is expected that the adhesion of Ni on rGO@CFRP is enhanced compared to Cu. In contrast, the adhesion of deposited Ni is reduced, suggesting diffusion of H+ between rGO and CFRP, which promotes the hydrogen evolution reaction (HER) and results in the formation of free-standing Ni foils. We ascribe this phenomenon to the unique properties of rGO and the nature of Cu and Ni deposition from electrolytic baths. In the latter, the high adsorption energy of Ni on defective rGO along with HER is the key factor for the formation of the porous layer and free-standing foils.

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A comparison of chemical and atmospheric plasma assisted copper plating on carbon fiber reinforced epoxy polymer surfaces

Cited by 21 publications

References 12 publications

Effect of Barrier Plasma Pre-Treatment on Polyester Films and their Adhesive Properties on Oak Wood

Effect of Barrier Plasma Pre-Treatment on Polyester Films and their Adhesive Properties on Oak Wood

Metallization of carbon fiber reinforced polymers: Chemical kinetics, adhesion, and properties

New Insights into the Metallization of Graphene-Supported Composite Materials─from 3D Cu-Grown Structures to Free-Standing Electrodeposited Porous Ni Foils

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