A Comparison of Methods for Determining Putrescibility or Oxygen Demand.

Hale, Frank E.; Melia, Thomas W.

doi:10.1021/ie50081a007

Cited by 3 publications

(3 citation statements)

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“…It has been shown that corrosion-related phenomena depend not only on the material property itself but also on cross-functional phenomena with the base microstructure. [1][2][3][4] Even though the results of various studies show that Sn-3.0Ag-0.5Cu (wt.%) (SAC305) solder exhibits better corrosion resistance than other Sn-based alloy compositions (including Sn-Pb) due to its high noble-metal content (Ag and Cu) and its theoretically stable structure, [6][7][8][9] the combination of localized corrosion and thermal cycling stress concentrations can degrade the material, which must be considered for certain environmental applications. However, a recent study on the thermal fatigue performance of Sn-Pb and Sn-Ag-Cu solder alloys showed that the dualphase microstructure of Sn-Pb is relatively resistant to corrosion, but the more stable Sn-Ag-Cu showed deeper degradation due to corrosion penetration at critical locations.…”

Section: Introductionmentioning

confidence: 99%

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Lee

Liu

Zhou

et al. 2011

Journal of Elec Materi

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The impact of a marine environment on Sn-Ag-Cu interconnect reliability is examined using salt spray exposure followed by thermal cycling. Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment with 5% NaCl salt spray, were thermally cycled to failure. The prior salt spray reduced the characteristic lifetime of the Sn-Ag-Cu solder joints by over 43%. Although Sn-based materials show strong resistance to corrosion, the nature of localized corroded areas at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. An important link between the corrosion path and Sn grain orientation was observed using orientation imaging microscopy (OIM). A strong correlation between the corrosion path and grain orientation was identified, indicating that the corrosion attack preferentially followed the basal plane of the Sn lattice.

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Section: Introductionmentioning

confidence: 99%

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Lee

Liu

Zhou

et al. 2011

Journal of Elec Materi

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“…[5][6][7] It has been reported that the main component of solder alloys, tin (Sn), resists corrosion because of the passivity of the film that forms on its surface. 8 The results of various studies show that Sn-3.0Ag-0.5Cu (wt.%) (SAC305) solder exhibits better corrosion resistance than other Sn-based alloy compositions due to its high content of noble or inert elements (Ag and Cu) and its theorized stable structure.…”

Section: Introductionmentioning

confidence: 99%

“…8,9 The Ag and Sn in SAC305 solder react with each other to form an intermetallic compound (IMC) (Ag 3 Sn) which is well distributed in the matrix. The Cu and Sn in SAC305 solder are known to form the intermetallic compound (Cu,Ni) 6 Sn 5 at the interface of the solder and inside the solder bulk. Since these IMCs are chemically stable, they are nearly insoluble in etchants, making them stable against corrosion.…”

Section: Introductionmentioning

confidence: 99%

Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

Liu

Lee

Liu

2011

Journal of Elec Materi

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Understanding the sensitivity of Pb-free solder joint reliability to various environmental conditions, such as corrosive gases, low temperatures, and high-humidity environments, is a critical topic in the deployment of Pb-free products in various markets and applications. The work reported herein concerns the impact of a marine environment on Sn-Pb and Sn-Ag-Cu interconnects. Both Sn-Pb and Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment by 5% NaCl salt spray, were thermally cycled to failure. The salt spray test did not reduce the characteristic lifetime of the Sn-Pb solder joints, but it did reduce the lifetime of the Sn-Ag-Cu solder joints by over 43%. Although both materials showed strong resistance to corrosion, the localized nature of the corroded area at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. The mechanisms leading to these results as well as the extent, microstructural evolution, and dependency of the solder alloy degradation are discussed.

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