A comparison of power supply planes in thick and thin film MCM's

Lee, K.; Barber, A.

doi:10.1109/epep.1994.594038

Cited by 4 publications

(2 citation statements)

References 6 publications

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“…Currents injected by active devices and/or power voltages applied to the conductors produce induced charges and currents on the conductor surfaces, which in turn generate induced electromagnetic fields. The electric field E(r) can be expressed in terms of a vector potential A(r) and a scalar potential Φ(r) as (1) where A(r) and Φ(r) are related to the charge and current densities q(r) and J(r) by the following relation: (2) (3)…”

Section: Electromagnetic Modeling and Analysis 31 Electromagnetic Fomentioning

confidence: 99%

“…With the ever increasing speed and density of digital integrated circuit systems, effects due to field interaction among IC chips, packages and PCB boards have become more and more the limiting factors in high speed system design [1][2][3]. Signal integrity effects such as propagation delay, crosstalk, and simultaneous switching noises (SSN) require more accurate and efficient electromagnetic analysis and modeling beyond the traditional static method with a few lumped circuit elements.…”

Section: Introductionmentioning

confidence: 99%

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Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

Yuan¹

Proceedings 1998 Design and Automation Conference. 35th DAC. (Cat. No.98CH36175)

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The electromagnetic modeling and parameter extraction of digital packages and PCB boards for system signal integrity applications are presented. A systematic approach to analyze complex power/ ground structures and simulate their effects on digital systems is developed. First, an integral equation boundary element algorithm is applied to the electromagnetic modeling of the PCB structures. Then, equivalent circuits of the power/ground networks are extracted from the EM solution. In an integrated simulation scheme, the equivalent circuits are combined with signal nets, package models, device circuits, and other external circuitry for system level signal integrity analysis and simulation. This methodology has been implemented as software tools and applied to practical design problems. Effects related to power/ground networks, such as simultaneous switching noises, crosstalk, and ground discontinuity are analyzed for realistic designs. INTRODUCTIONWith the ever increasing speed and density of digital integrated circuit systems, effects due to field interaction among IC chips, packages and PCB boards have become more and more the limiting factors in high speed system design [1][2][3]. Signal integrity effects such as propagation delay, crosstalk, and simultaneous switching noises (SSN) require more accurate and efficient electromagnetic analysis and modeling beyond the traditional static method with a few lumped circuit elements. Particularly, the power/ground supply networks in digital circuits involve complex, large structures such as combinations of plane/partial planes and routed traces in multilayer environment, and are often tightly coupled with other parts of the circuit systems, such as signal networks and chip packages. Characterization of true distributed effect and frequency dependence is crucial. On the other hand, due to the overwhelming complexity of digital circuit board, full-wave rigorous electromagnetic field solutions, such as those used in microwave analysis [4], become impractical for digital application because of the extremely high computational requirement, and the difficulty of integrating with time-domain circuit type simulators and design environments used by digital designers. Therefore, EM modeling and simulation methodologies that can handle large complex digital designs with reasonable accuracy and efficiency, and can provide good macro models over extended frequency bands, are very much desired and thus present a challenge to us [5][6][7][8].This paper presents a systematic approach which includes an efficient method for the electromagnetic modeling of packages and power/ground structures, and an integrated process for the analysis and simulation of system signal integrity and SSN effect in practical digital designs. The focus of this work is to develop a fast, flexible and accurate electromagnetic model with a clear circuit interpretation for the power/ground network, and to integrate it with active device models, transmission line networks, and chip package parasitics in a ti...

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Section: Electromagnetic Modeling and Analysis 31 Electromagnetic Fomentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

Yuan¹

Proceedings 1998 Design and Automation Conference. 35th DAC. (Cat. No.98CH36175)

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14nalysis and Simulation of Complex Interconnect Structures andd Power/Ground Distribution Networks

Yuan¹

Proceedings of Electrical Performance of Electronic Packaging

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Analysis and modelling of power distribution networks and plane structures in multichip modules and PCB's

Yuan¹,

Postel²,

Rubin³

Proceedings of International Symposium on Electromagnetic Compatibility

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A comparison of power supply planes in thick and thin film MCM's

Abstract: A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed and verified with thick and thin film MCM substrates. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers.

Cited by 4 publications

References 6 publications

Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

Electromagnetic modeling and signal integrity simulation of power/ground networks in high speed digital packages and printed circuit boards

14nalysis and Simulation of Complex Interconnect Structures andd Power/Ground Distribution Networks

Analysis and modelling of power distribution networks and plane structures in multichip modules and PCB's

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