This paper derives the theory and method of the two dimensional discrete TL and CTL models including high frequency skin effect for an arbitrary shaped plane pair in a multiple dielectric layer structure. The null or peak of the S parameter frequency response represents the test port interaction with the resonant standing wave of these planes at that frequency. The resultant S parameter data of these models can be condensed into a simpler N port equivalent circuit to represent a larger hierarchical power and ground plane network for fast simulation.

We will describe a bare chip probing fixture for temporary interconnection of a VLSI tester to a die. It is capable of connecting to an area array of die pads, can operate beyond 1 GHz, and is extensible to 1000 signal I/O's. This probe has been adapted to an existing VLSI tester by attaching it to a custom DUT board and has been used to test operational silicon. The fixture consists of a four metal layer membrane probe which is an enhancement to a previously described burn-in fixture with a novel alignment scheme and no-wipe contacting buttons. The probe is electrically connected to the DUT pcb with an array of button connections, and board I/O is through coaxial cables to the tester. A mechanical structure provides alignment of the pcb, button connector, and membrane probe while providing controlled pressure between the membrane and die, and at the same time cooling the die. We will describe the electrical performance of the interconnect and the results of testing a circuit toggling at up to 1 GHz, compare them with another probing solution and describe future improvements contemplated. In addition, we will briefly describe the potential for use as a very fast bare chip burn-in fixture.

A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed and verified with thick and thin film MCM substrates. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers.

A method that would allow accurate modeling of arbitrarily shaped planes with bypass capacitors has been developed. It is compatible with a SPICE based modeling method for the rest of the power supply hierarchy and the devices.A modified SPICE is used to accommodate distributed circuits. The distributed circuits are built with microwave analysis software and connected to SPICE by s-parameter files. The modeling process is described and examples of thick and thin film power supply planes are presented with comparison to measured results. The method is used to explore potential design choices for a large MCM with many simultaneously switching drivers.

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