Modeling and analysis of multichip module power supply planes

Lee, Keunmyung; Barber, A.

doi:10.1109/96.475268

Cited by 158 publications

(1 citation statement)

References 9 publications

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“…There are many symptomatic treatments, such as filters, to suppress the electromagnetic noise 3,4 . However, these treatments require the experience of skilled engineers because the causes of electromagnetic noise phenomena are not clearly understood and cannot be described quantitatively using equivalent circuit modeling and impedance analysis in the frequency domain 5,6 . A fundamental understanding of the mechanisms of electromagnetic noise is needed for noiseless circuit design.…”

Section: Introductionmentioning

confidence: 99%

Time-domain Formulation of a Multi-layer Plane Circuit Coupled with Lumped-parameter Circuits using Maxwell Equations

Jinno

Kitora

Toki

et al. 2019

Sci Rep

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We calculate electromagnetic phenomena in the multi-layer plane circuit starting from the Maxwell equations. We present a numerical method of potential and current density in two-dimensional conductors, where their time developments are treated as phenomena of wave propagation. We treat the plane conductors by dividing them into small finite-volume elements, similar to the case of the partial element equivalent circuit method, and the transport equations are then solved by the finite-difference time-domain method. Furthermore, we develop a calculation method for the boundary in a multi-layer plane by applying the method we have used in multi-transmission lines. We formulate the boundary conditions of a multi-layer plane coupled with lumped-parameter circuits and introduce an algorithm to reduce calculation costs that are largely associated with the two-dimensional extension from the multi-transmission-line case. We perform calculations of the wave propagation of potential, current density, and charge density in the time domain for a simple plane circuit. These calculations are presented as supplementary materials of the present paper.

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Section: Introductionmentioning

confidence: 99%

Time-domain Formulation of a Multi-layer Plane Circuit Coupled with Lumped-parameter Circuits using Maxwell Equations

Jinno

Kitora

Toki

et al. 2019

Sci Rep

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Equivalent inductance of power‐distribution planes in multilayer printed circuit boards and capacitor allocation for decoupling

Harada

Kobayashi

2006

Electron Comm Jpn Pt II

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SUMMARYIn order to obtain a design guideline related to the optimum allocation of decoupling capacitor to reduce unwanted electromagnetic wave radiation due to voltage variation and to supply the charge needed for chip operation in a multilayered printed circuit board, the equivalent inductance of the power distribution system is quantitatively analyzed. The power distribution system is represented by a two-dimensional equivalent circuit network and is analyzed. It is found that the parasitic inductance becomes smaller as the distance between the power distribution plane and the ground plane decreases. Further, this result is applied to optimum allocation of the capacitor near the LSI power distribution pin for suppression of LSI malfunctions and to quantification of the radiation suppression effect of capacitor allocation near the via hole that is generated in the interconnect processing of the signal pattern through the power distribution plane and the ground plane. The relationship of the spacing between the planes to the distance between the power distribution pin and the capacitor is formulated so as to keep the power distribution voltage variations within a certain range. Also formulated is the relationship of the radiation suppression effect to the distance between the via hole and the capacitor location in order to obtain constant radiation suppression efficiency. In this way, specific design values of capacitor allocation are obtained for suppression of LSI malfunctions and unwanted electromagnetic radiation.

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Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Chen

Jancura

Virga

et al. 2003

Micro & Optical Tech Letters

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Shrinkage behavior of a plastic plays a critical role in determining the final dimensions of an injection‐molded part. It is well known that process conditions affect many properties of plastic parts, including shrinkage. This study applies the Taguchi method to systematically investigate the effects of process conditions on the shrinkage (along‐ and across‐the‐flow directions) of three plastics: high‐density polyethylene (HDPE), general‐purpose polystyrene (GPS), and acrylonitrile‐butadiene‐styrene (ABS). The results show that HDPE, a semicrystalline plastic, shrinks more than GPS and ABS, two amorphous materials. The extent of anisotropic shrinkage in the along‐the‐flow and across‐the‐flow directions for HDPE is different from GPS and ABS. More shrinkage occurs in the across‐the‐flow direction of HDPE than in its along‐the‐flow direction. The reverse is true for GPS and ABS. Mold and melt temperatures, along with holding pressure and holding time, are the most significant influences on the shrinkage behaviors of three materials, although the importance of each is different for each plastic. The optimal conditions for reducing shrinkage identified by the Taguchi method are experimentally verified and validated by t‐statistic tests. The prediction matches very well with the experimental value for the along‐the‐flow shrinkage of GPS.

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Modeling and analysis of multichip module power supply planes

Cited by 158 publications

References 9 publications

Time-domain Formulation of a Multi-layer Plane Circuit Coupled with Lumped-parameter Circuits using Maxwell Equations

Time-domain Formulation of a Multi-layer Plane Circuit Coupled with Lumped-parameter Circuits using Maxwell Equations

Equivalent inductance of power‐distribution planes in multilayer printed circuit boards and capacitor allocation for decoupling

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

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