1998
DOI: 10.1016/s0169-4332(97)00424-8
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A comparison of S-passivation of III–V (001) surfaces using (NH4)2Sx and S2Cl2

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Cited by 33 publications
(12 citation statements)
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“…b, which is increased after annealing we conclude that a gallium sulfide (GaS) phase was formed upon heating . Also the occurrence of the S 2p component (I) in the same figure supports this finding since it is assigned to a S‐Ga bond . In addition, the total intensity of the As 3d peak remains more or less unchanged with an increased bulk component (II), which is related to a Ga–As bond and a decreased surface component (I), which is related to an As–S bond.…”
Section: Discussionsupporting
confidence: 71%
See 1 more Smart Citation
“…b, which is increased after annealing we conclude that a gallium sulfide (GaS) phase was formed upon heating . Also the occurrence of the S 2p component (I) in the same figure supports this finding since it is assigned to a S‐Ga bond . In addition, the total intensity of the As 3d peak remains more or less unchanged with an increased bulk component (II), which is related to a Ga–As bond and a decreased surface component (I), which is related to an As–S bond.…”
Section: Discussionsupporting
confidence: 71%
“…In the Ga 3s/S 2p region, two S 2p doublets (spin–orbit splitting of 1.1 eV and intensity ratio of 0.5) are fitted together with a single Ga 3s profile according to Ref. . After annealing, both, the S 2p (I) and the Ga 3s (II) emissions are rising whereas the S 2p (III) emission is attenuated.…”
Section: Resultsmentioning
confidence: 99%
“…20 Ohmic back contacts were prepared on the reverse of all samples prior to insertion into the OMBD/analysis environment. Following in situ annealing to 450 C to remove excess sulfur, ordered and oxygenfree surfaces were confirmed by photoelectron spectroscopy and the observation of characteristic 2 Â 1 Low Energy Electron Diffraction (LEED) patterns.…”
Section: Methodsmentioning
confidence: 99%
“…It was reported that the (NH 4 ) 2 S solution can almost remove but not completely the native oxides on InP [7][8][9] and cover the surface with sulfur atoms to prevent further oxidization [10]. In this work, we characterize the Al/InP Schottky contact by (NH 4 ) 2 S treatment and the corresponding Al/InP Schottky barrier MOSFETs (SB-MOSFETs) with TiO 2 /Al 2 O 3 as gate oxides.…”
mentioning
confidence: 99%