A Comparison Study of the Bondability and Reliability Performance of Au Bonding Wires with Different Dopant Levels

Stephan, D.; Chew, Y.H.; Goh, H.M.; Pasamanero, E.; Theint, Ei Phyu Phyu; Calpito, D.R.M.

doi:10.1109/eptc.2007.4469780

Cited by 7 publications

(5 citation statements)

References 4 publications

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“…High Temperature Storage Test (HTST) was performed in oven at 175 o C in an air environment. HTST is usually conducted to simulate the reliability of the bonding interface over time [8]. During different time intervals, 0 hours, 100 hours, 250 hours and 500 hours, WPT was subjected to study the microscopic morphology optical microscope.…”

Section: A 01 M Sg Film Substrate Bondability Studymentioning

confidence: 99%

Study of gold wire bonding on 0.1 μm soft gold film substrate

Zhang¹,

Guo²,

Li³

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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0.1 m soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3~0.5 m soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam (FIB) and scanning electron microscope (SEM) observation. A design of experiments (DOE) was set up to figure out the optimistic process window for gold wire bonding on Ni-Pd-Au substrate.

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Section: A 01 M Sg Film Substrate Bondability Studymentioning

confidence: 99%

Study of gold wire bonding on 0.1 μm soft gold film substrate

Zhang¹,

Guo²,

Li³

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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“…However, when the chip is molded, these two tests are not applicable. Non destructive analysis, such as scanning acoustic microscopy (SEM), usually cannot detect pad cracks if the cracks are pretty small and delamination layer is absent [5]. Even though there is no reliability risk, however we need to further understand why there is such passivation cracks during cratering test.…”

Section: Introductionmentioning

confidence: 99%

Investigation of bond pad etching chemistries for passivation crack

Ibrahim¹,

Leoni²,

Kheng³

et al. 2010

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)

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Wire bonding is still a very common method for connecting the pads on a chip to the package. During the ultrasonic wire bonding process, several failures such as ball neck failure, missing ball, bond metal peeling or crack etc., may be generated. Of those failures, bond pad peeling or crack is a phenomenon detected after bonding process and is identified as a critical reliability problem and is known as a complex defect to investigate. Bond pad cracks pose a high reliability risk and potential failure during environmental stress testing. Damage to the bond pad may be the result of sub optimized probe or wirebond process parameters, as well as poor pad design. In addition, bond pad cracks may be unintentionally induced by the cratering test chemical etch solution.There is a case where an assembly folk reported had a bond pad crack, but none of the parts have failure during electrical test or even after reliability stress. In such case, we believe the crack found at assembly was an artifact induced by etching chemical, resulting the over-rejecting the parts. This paper specifically discusses a comparative analysis of various bond pad etching methods and their impact on bond pad cracking.There are few interesting findings will also be shared during the discussions. Failure analysis results are also briefly discussed.

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“…High purity Au wires have been used as an interconnection for most device packages [ 12 , 13 ] as Au has high temperature resistance, excellent conductivity, and good oxidation resistance. Presently, gold wire ball welding has become one of the commonly used welding processes in sensor packaging technology [ 14 , 15 ].…”

Section: Introductionmentioning

confidence: 99%

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

Wang

Liu

et al. 2022

Micromachines

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The long-term application of sensors in a high-temperature environment needs to address several challenges, such as stability at high temperatures for a long time, better wiring interconnection of sensors, and reliable and steady connection of the sensor and its external equipment. In order to systematically investigate the reliability of thin coatings at high temperatures for a long time, Au and Cr layers were deposited on silicon substrates by magnetron sputtering. Additionally, samples with different electrode thicknesses were annealed at different temperatures for a varied duration to study the effect of electrode thickness, temperature, and duration on the reliability of samples. The results of tensile and probe tests before and after heat treatment revealed that the mechanical strength and electrical properties have changed after annealing. In addition, the bonding interface was analyzed by a cross-sectional electron microscope. The analysis showed that long-term continuous high-temperature exposure would result in thinning of the electrode, formation of pores, recrystallization, and grain growth, all of which can affect the mechanical strength and electrical properties. In addition, it was observed that increasing the thickness of the gold layer will improve reliability, and the test results show that although the thin metal layer sample is in poor condition, it is still usable. The present study provides theoretical support for the application of thin coatings in high temperatures and harsh environments.

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A Comparison Study of the Bondability and Reliability Performance of Au Bonding Wires with Different Dopant Levels

Cited by 7 publications

References 4 publications

Study of gold wire bonding on 0.1 μm soft gold film substrate

Study of gold wire bonding on 0.1 μm soft gold film substrate

Investigation of bond pad etching chemistries for passivation crack

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

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A Comparison Study of the Bondability and Reliability Performance of Au Bonding Wires with Different Dopant Levels

Cited by 7 publications

References 4 publications

Study of gold wire bonding on 0.1 &#x03BC;m soft gold film substrate

Study of gold wire bonding on 0.1 &#x03BC;m soft gold film substrate

Investigation of bond pad etching chemistries for passivation crack

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

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Product

Resources

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Study of gold wire bonding on 0.1 μm soft gold film substrate

Study of gold wire bonding on 0.1 μm soft gold film substrate