A Continuous Flow Microelectrophoretic Module for Protein Separation

Capuano, Andrea; Adami, Andrea; Mulloni, Viviana; Lorenzelli, Leandro

doi:10.1007/978-3-319-66802-4_15

Cited by 1 publication

(2 citation statements)

References 6 publications

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“…Note: aspect-ratios up to ~3 have been reported 21) + Multilevel, stepped, complex 3D structures (e.g. closed microchannels) can be realized by sequential processing and stacking of several layers 21,22,30,32,38,39) -For multilevel/embedded 3D structures process control is very important. 25) Multiple lamination, beyond a certain number of layers, might not be ideal for volume manufacturing + Passive microfluidic structures (e.g.…”

Section: Advantages Limitationsmentioning

confidence: 99%

“…Diverse interesting applications and prototypes have been reported in literature. [35][36][37][38][39] The possibility to lithographically pattern these dry-films using standard UV-exposure tools (and masks) in order to realize passive microfluidic features such as channels or chambers, makes them most suitable for the manufacturing of CMOS-based lab-on-a-chip devices. More information on recent efforts reported on CMOS-based lab-on-a-chips can be found in the book edited by Lee et al on CMOS biotechnology, Ref.…”

Section: Introductionmentioning

confidence: 99%

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Adhesive wafer bonding for CMOS based lab-on-a-chip devices

Karl¹,

Schikowski²,

Thon³

et al. 2020

Jpn. J. Appl. Phys.

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Adhesive wafer bonding using laminated photosensitive dry-resist offers many advantages and can be used to realize advanced, CMOS integrated, lab-on-a-chip devices. The low bond-temperatures involved allow the hybrid integration of a range of substrates, e.g. CMOS wafers with structured MEMS glass wafers. The dry-film polymer functions as an adhesive interlayer and can be lithographically patterned to form sealed microfluidic fluid channels and chambers. This approach is well suited for low-cost R&D prototyping, and efforts reported in the past were often limited to proof-of-concept devices. However, all of the involved process steps do have the potential to be scaled up for an industrial volume production. We report on our activities to implement a baseline 8″ process flow, using the ORDYL SY300 series of permanent dry-film resist, to enable the commercial manufacturing of microfluidic devices based on this technology at a MEMS foundry. Advantages and disadvantages of the presented approach are discussed.

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