A Cost Comparison of New MCM Technologies

Abstract

In the course of technology development, decisions must be made about the nature of future progress. To aid in this decision‐making process, Technical Cost Modelling has evolved from traditional cost modelling methodologies in order to accurately predict the dynamics of a system of manufacture. As an example of the utility of this methodology, a new MCM technology has been chosen for cost analysis: deposited dielectric on laminate (MCM‐D/L) electronic packages. For this illustration, the cost drivers are determined and cost/performance trade‐offs with MCM‐D and MCM‐L analysed. With this disciplined approach to cost prediction, technology development cost issues can be decided thoroughly yet fairly quickly.

Plating of small blind vias [multilayer PCBs]

“…As the number of inputs/outputs (I/O's) on a chip increases, the amount of wiring required to interconnect the chip increases. However, the size of electronic devices continue to shrink by increasing the number of signal planes and the wiring density [3]- [7], reducing line widths [3]- [7], and introducing smaller holes and vias [8], [9]. Sequential build-up technologies in fabrication have been rapidly developing to achieve such high density multilayer printed circuit boards, PCB's [10]- [18].…”

“…Vias as small as 75 m in diameter and 50 m in depth have been produced by oxygen plasma etching [8], [9]. Photodevelopment of vias using photosensitive solder mask as the dielectric has been developed to form 125 m diameter vias [11]- [13].…”