A Cost Effective Hermetically Sealed 106 Gbit/s PAM4 EML TO-CAN For Beyond-5G Mobile Fronthaul

Fujihara, Ryota; Shirao, Mizuki; Nakamura, Seiki; Nakano, Seiji; Hasegawa, Kiyotomo

doi:10.1109/ecoc48923.2020.9333316

Cited by 2 publications

(1 citation statement)

References 6 publications

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“…As specified in this standard, an interface with a 100-Gbit/s/λ signal (53.125-Gbaud 4-level pulse-amplitudemodulation (4-PAM)) was used. To meet this requirement, various high-speed optical transmitters have been reported, including directly modulated lasers (DMLs) [2,3] and electroabsorption modulator integrated distributed-feedback (EADFB) lasers [4][5][6][7]. With the demand for a further increase in network capacity, 800-Gbit/s and 1.6-Tb/s systems are now Shigeru Kanazawa, Takahiko Shindo, Mingchen Chen, Yasuhiko Nakanishi, Shohei Kosuga, and Hirotaka Nakamura are with NTT Device Innovation Center, NTT Corporation, Atsugi 243-0198, Japan (e-mail:…”

Section: Introductionmentioning

confidence: 99%

224-Gbit/S 4-PAM Operation of Compact DC Block Circuit Integrated Hi-FIT AXEL Transmitter With Low Power Consumption

Kanazawa

Shindo

Chen

et al. 2023

J. Lightwave Technol.

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We previously developed a semiconductor optical amplifier (SOA) assisted extended reach electroabsorption modulator integrated distributed feedback (EADFB) laser (AXEL) to increase the optical modulation output power and a high-frequency integrated design based on the flip-chip interconnection technique (Hi-FIT) to obtain a high modulation bandwidth. We achieved a high-output power 224-Gbit/s 4-level pulse-amplitude-modulation (4-PAM) operation of a Hi-FIT AXEL module. In this paper, we developed a compact DC block circuit integrated into Hi-FIT AXEL module to decrease chippower consumption without increasing the sub-assembly size and degrading the modulation bandwidth. We designed a Hi-FIT AXEL sub-assembly, that include a flip-chip interconnection board with a DC block circuit that affects the modulation bandwidth. We achieved a 3-dB bandwidth of up to 64 GHz for this designed sub-assembly. The fabricated Hi-FIT AXEL module has a 3-dB bandwidth of more than 62 GHz and a flat frequency response up to 50 GHz. For the 224-Gbit/s 4-PAM operation, the fabricated Hi-FIT AXEL module has a chip-out average output power of +10.0 dBm with a transmitter eye-closure quaternary (TECQ) of 1.9 dB. The integrated compact DC block circuit can reduce chip power consumption by up to 17%.

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