2018
DOI: 10.11591/ijeecs.v10.i2.pp617-622
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A Cross Slot Coupling to Enhance Bandwidth of Dual-Layer SIW Structure

Abstract: In this paper, design characteristics of cross slot coupling have been explored and realized in a proposed dual-layer SIW prototype for bandwidth enhancement at 10.0 GHz. The assembled prototype consists of two SMA-microstrip input/output interface with low-loss microstrip-taper via transition and two manually stacked SIW structures electrically connected via a small cross slot coupling design. The proposed dual-layer SIW structure is designed using CST software and fabricated using conventional Printed Circui… Show more

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Cited by 2 publications
(2 citation statements)
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“…where c is the speed of light, εr is the dielectric constant, W is the width of waveguide port, d is the via holes diameter and p is the distance between via holes (centre to centre). In order to achieve an excellent performance of the proposed SIW, a few design rules regarding the via holes, as written in expression (3) to (5) need to be followed [16][17].…”
Section: Figure 1 Topology Of the Six-portmentioning
confidence: 99%
“…where c is the speed of light, εr is the dielectric constant, W is the width of waveguide port, d is the via holes diameter and p is the distance between via holes (centre to centre). In order to achieve an excellent performance of the proposed SIW, a few design rules regarding the via holes, as written in expression (3) to (5) need to be followed [16][17].…”
Section: Figure 1 Topology Of the Six-portmentioning
confidence: 99%
“…This technology makes it possible to fabricate a complete circuit in planar form. Besides, losses can be reduced by mounted on chip-sets using same substrate [14][15][16].…”
Section: Introductionmentioning
confidence: 99%