A de-embedding technique for interconnects

Song, Jiming; Ling, Feng; Flynn, G.; Blood, W.; Demircan, Ertugrul

doi:10.1109/epep.2001.967628

Cited by 65 publications

(3 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…5. In order to compensate for the transmission loss of the MSLs outside the reference planes, the "through" patterns that have only a MSL with a length excluding the distance between the reference planes was prepared, and these potions were de-embedded using measured S -parameters [12]. Since the through lines showed very good matching with 50 Ω characteristic impedance, deembedding was done by just subtracting the line losses from the total insertion and return losses as shown in the follow- Return Loss = 20 log 10 S 11,total (ω)…”

Section: Measurement Resultsmentioning

confidence: 99%

Characterization of Multi-Layer Ceramic Chip Capacitors up to mm-Wave Frequencies for High-Speed Digital Signal Coupling

Shibata

Kato

2020

IEICE Trans. Electron.

View full text Add to dashboard Cite

Capacitive coupling of line coded and DC-balanced digital signals is often used to eliminate steady bias current flow between the systems or components in various communication systems. A multi-layer ceramic chip capacitor is promising for the capacitor of very broadband signal coupling because of its high frequency characteristics expected from the downsizing of the chip recent years. The lower limit of the coupling bandwidth is determined by the capacitance while the higher limit is affected by the parasitic inductance associated with the chip structure. In this paper, we investigate the coupling characteristics up to millimeter wave frequencies by the measurement and simulations. A phenomenon has been found in which the change in the current distribution in the chip structure occur at high frequencies and the coupling characteristics are improved compared to the prediction based on the conventional equivalent circuit model. A new equivalent circuit model of chip capacitor that can express the effect of the improvement has been proposed.

show abstract

Section: Measurement Resultsmentioning

confidence: 99%

Characterization of Multi-Layer Ceramic Chip Capacitors up to mm-Wave Frequencies for High-Speed Digital Signal Coupling

Shibata

Kato

2020

IEICE Trans. Electron.

View full text Add to dashboard Cite

show abstract

“…The accuracy of a characterization method is essentially determined by the accuracy of its de-embedding algorithm. Most de-embedding methods are based on the twoline method, which measures two transmission lines of the same cross-section with different lengths [1,2,3]. For example, the two stripline test vehicles in Fig.…”

Section: Introductionmentioning

confidence: 99%

“…Two striplines (4 mm and 8 mm in length) were designed to have the same via transition to the probing pad. Measured S-parameters were de-embedded using two variants of the two-line method: the L-2L method [1] and the LiLj method [2]. The extracted DK values are compared in Fig.…”

Section: Introductionmentioning

confidence: 99%

Complex permittivity extraction from PCB stripline measurement using recessed probe launch

Hwang

Park

Kam

2015

IEICE Electron. Express

View full text Add to dashboard Cite

A method to extract the complex permittivity of a dielectric material in a PCB is presented. The recessed probe launch allows striplines to be measured without the need of via transitions that are subject to large process variations. After pad parasitics are de-embedded using the two-line method, the complex permittivity of the dielectric is calculated from 20 MHz to 5 GHz using closed-form equations. Internal inductance is taken into account to prevent overestimation of the permittivity at low frequency.

show abstract

S-Parameters for Signal Integrity

Pupalaikis

2020

View full text Add to dashboard Cite

A de-embedding technique for interconnects

Cited by 65 publications

References 4 publications

Characterization of Multi-Layer Ceramic Chip Capacitors up to mm-Wave Frequencies for High-Speed Digital Signal Coupling

Characterization of Multi-Layer Ceramic Chip Capacitors up to mm-Wave Frequencies for High-Speed Digital Signal Coupling

Complex permittivity extraction from PCB stripline measurement using recessed probe launch

S-Parameters for Signal Integrity

Contact Info

Product

Resources

About