A direct-drive SCARA robot for wafer&amp;ceramic-substrate handling based on visual servoing

He, Yunbo; Zhang, Chang; Wentao, Ye; He, Zhihua; Chen, Xin; Gao, Jian; Zhang, Kai; Yang, Zhijun; Chen, Xun; Chen, Yun; Tang, Hui

doi:10.1109/iccis.2017.8274814

Cited by 5 publications

(3 citation statements)

References 11 publications

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“…There are several structures for handling robots that can be used in semiconductors. The authors in [34,35] developed a four-DOF (degree-of-freedom) direct-drive SCARA (selective compliance assembly robot arm) robot for wafer handling purposes. The dynamic model of the SCARA robot was realized via the Newton-Euler and Lagrangian methods.…”

Section: Overviewmentioning

confidence: 99%

A Multidisciplinary Mechatronics Program: From Project-Based Learning to a Community-Based Approach on an Open Platform

Phan

Ngo

2020

Electronics

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To face contemporary problems, international engineers must be trained in advanced learning environments and with professional skills and knowledge. Sponsored by USAID (US Agency for International Development), the Build-IT (Building University-Industry Learning and Development through Innovation and Technology) program leverages the vast capabilities of the implementing partner from Arizona State University and plays a key role as an innovative pioneer in converging personalities from various fields. A well-educated engineer can contribute to the sustainable development of society. With the aim of building community-oriented education, an integrated strategy was proposed in which a problem-based learning method is investigated to apply technical knowledge. In accordance with this strategy, in our proposed method, students from Mechatronics Engineering first had to work together with other learners in the electronics, software, control automation, and mechanics fields, followed by the design of an open platform integrated multi-disciplinary approach. By collaborating with their peers in developing this hardware, students become better equipped with specialized knowledge. This process also allows students to feel confident in implementing their innovative thinking while still maintaining the core meaning of the instrument. One of the key benefits of this approach is that helping students overcome their problems concurrently enhances the engineer’s function in the community despite missing some specialized skill sets. Based on experimental works using this open framework, the present approach demonstrates that pupils in our program have sufficient ability to contribute to social achievements. Lastly, the feasible, low-cost, and visually educational instrument made by the participants showcases the value of such a multi-disciplinary approach.

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Section: Overviewmentioning

confidence: 99%

A Multidisciplinary Mechatronics Program: From Project-Based Learning to a Community-Based Approach on an Open Platform

Phan

Ngo

2020

Electronics

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“…This study is performed justified by the fact that the shafts present hair pair joint categorized under those of point surface. He et al, 2017 [20] developed a SCARA robot for application of the handling of ceramic substrate and wafers aiming to add higher levels of flexibility to the system as a whole. Ibrahim & Khalil, 2010 [21] study robots with modules that are connected serial and parallelly with nonredundancy, known as Hybrid robots.…”

Section: Literature Reviewmentioning

confidence: 99%

Direct and Inverse Cinematic Resolution Calculation using Denavit-Hartenberg Algorithm and Geometric Method for Robot with 5 DOF

Jimenez-Nixon,

Paredes-Sanchez,

Parada-Acosta

2023

Proceedings of the 21th LACCEI International Multi-Conference for Engineering, Education and Technology (LACCEI 2023): “Leaders

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This manuscript aims to shine light on the analysis done for the direct and inverse kinematics of a 5 DOF robot. Where the main objective is to add a 5th degree of freedom to a traditional SCARA robot due to the extent of the study, it was fitting to cover in a more in-depth manner the control system separately to continue to add to the state of the art. It was possible to solve the direct and inverse kinematics of an inverse SCARA robot with 5 DOF using Denavit-Hartenberg algorithm and geometric method, respectively. The Denavit-Hartenberg algorithm solves kinematics based on homogenous transformation matrices to pass through one system to another using the coordinates systems of every joint and link. Geometric method allows to solve complex kinematics in a simplified way by considering just the coordinates that provides finite solutions.A successful control system for an inverse SCARA of 5 DOF could be built using these two methods.

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“…Its effect increases when the semiconductor process enters the era of deep submicron meter (below 20 nm), e.g., EUV process. In order to solve the alignment problem, there are several approaches [ 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 ]. The most typical device is wafer pre-alignment system (which is called pre-aligner) that consists of rotation mechanics and optical vision sensor [ 6 ].…”

Section: Introductionmentioning

confidence: 99%

Wafer Center Alignment System of Transfer Robot Based on Reduced Number of Sensors

Kim¹

2022

Sensors

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This brief presents a wafer alignment algorithm with reduced sensor number that obtains the relative distance of the wafer center and the robot hand. By `reduced number’, in spite of smaller number of sensors than the conventional method, we mean an improved method which achieves the similar results to pre-existing algorithms. Indeed, it can be designed with only three sensor data, less than four sensors of the conventional algorithm. Thus, some advantages of the proposed alignment algorithm include that it can be designed with low cost and less computing power. The proposed alignment algorithm is applied to a transfer robot for coater/developer system in semiconductor processing for verifying the performance of the method. The performance of the proposed method is validated by both simulation and experimental results.

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A direct-drive SCARA robot for wafer&ceramic-substrate handling based on visual servoing

Cited by 5 publications

References 11 publications

A Multidisciplinary Mechatronics Program: From Project-Based Learning to a Community-Based Approach on an Open Platform

A Multidisciplinary Mechatronics Program: From Project-Based Learning to a Community-Based Approach on an Open Platform

Direct and Inverse Cinematic Resolution Calculation using Denavit-Hartenberg Algorithm and Geometric Method for Robot with 5 DOF

Wafer Center Alignment System of Transfer Robot Based on Reduced Number of Sensors

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