A Domain Decomposition Method for the Finite Element Simulation of Circuit Board Interconnects

Mao, Kaiyu; Tan, Jilin; Jin, Jian‐Ming

doi:10.1109/epep.2007.4387181

2007 IEEE Electrical Performance of Electronic Packaging 2007

DOI: 10.1109/epep.2007.4387181

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A Domain Decomposition Method for the Finite Element Simulation of Circuit Board Interconnects

Kaiyu Mao

Jilin Tan

Jian‐Ming Jin

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2022

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The state of the art in beyond 5G distributed massive multiple-input multiple-output communication system solutions

Meyer¹,

Kruglov²,

Krivic³

et al. 2022

Open Res Europe

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Beyond fifth generation (5G) communication systems aim towards data rates in the tera bits per second range, with improved and flexible coverage options, introducing many new technological challenges in the fields of network architecture, signal processing, and radio frequency front-ends. One option is to move towards cell-free, or distributed massive Multiple-Input Multiple-Output (MIMO) network architectures and highly integrated front-end solutions. This paper presents an outlook on beyond 5G distributed massive MIMO communication systems, the signal processing, characterisation and simulation challenges, and an overview of the state of the art in millimetre wave antennas and electronics.

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The state of the art in beyond 5G distributed massive multiple-input multiple-output communication system solutions

Meyer¹,

Kruglov²,

Krivic³

et al. 2022

Open Res Europe

View full text Add to dashboard Cite

show abstract

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A Domain Decomposition Method for the Finite Element Simulation of Circuit Board Interconnects

Cited by 1 publication

References 6 publications

The state of the art in beyond 5G distributed massive multiple-input multiple-output communication system solutions

The state of the art in beyond 5G distributed massive multiple-input multiple-output communication system solutions

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