2016
DOI: 10.1109/lawp.2015.2505091
|View full text |Cite
|
Sign up to set email alerts
|

A Dual-Frequency Broadband Design of Coupled-Fed Stacked Microstrip Monopolar Patch Antenna for WLAN Applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

1
34
0

Year Published

2016
2016
2021
2021

Publication Types

Select...
8

Relationship

1
7

Authors

Journals

citations
Cited by 93 publications
(35 citation statements)
references
References 11 publications
1
34
0
Order By: Relevance
“…Furthermore, performance comparison of the proposed SMPA antenna with counterpart design in the literature has been presented in Table . As it can be seen from the table, the SMPA antenna design not only achieves better radiation performance but also has smaller size to its counterpart design in the literature.…”
Section: D Fabrication and Experimental Results Of Smp Antennamentioning
confidence: 99%
“…Furthermore, performance comparison of the proposed SMPA antenna with counterpart design in the literature has been presented in Table . As it can be seen from the table, the SMPA antenna design not only achieves better radiation performance but also has smaller size to its counterpart design in the literature.…”
Section: D Fabrication and Experimental Results Of Smp Antennamentioning
confidence: 99%
“…To obtain broad bandwidth, parasitic patches are introduced on the top of driven patch, where these patches are fed by microstrip line and proximity model, respectively . Two circular patches are stacked and fed by common coupler technique to obtain dual broadband for WLAN applications that is investigated in Reference . A two and three layer stacked with E and U shaped slot patch antennas are investigated in References to achieve wide band application.…”
Section: Introductionmentioning
confidence: 99%
“…During the past years, numerous methods have been proposed to enhance the bandwidth of MPAs, such as increasing the thickness of the substrate [8,9], decreasing the substrate dielectric constant [10,11], loading chip resistor [12], using parasitic patches in single layer and multilayers configuration [13][14][15], employing electromagnetic band gap structures [16][17][18][19], and using backed edge-fed cavity [20,21]. However, most of these MPAs are made by adding additional structure so that their structures become more complex.…”
Section: Introductionmentioning
confidence: 99%