2013
DOI: 10.1039/c3py00461a
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A facile method to produce PBS-PEG/CNTs nanocomposites with controllable electro-induced shape memory effect

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Cited by 34 publications
(14 citation statements)
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“…Surprisingly, even under 4 wt% CNT loading, it is still possible to achieve 100% tensile strain, significantly larger than the tensile elongation reported from previous studies. Most of the electroactive SMP reported were characterized via bending test, due to the brittle nature of the CNT composites . For example, Luo et al demonstrated that without carbon nanofiber (CNF) reinforcement, epoxy matrix can withstand around 30% strain before failure but the strain at failure decreased to below 5% after incorporating CNF .…”
Section: Resultsmentioning
confidence: 99%
“…Surprisingly, even under 4 wt% CNT loading, it is still possible to achieve 100% tensile strain, significantly larger than the tensile elongation reported from previous studies. Most of the electroactive SMP reported were characterized via bending test, due to the brittle nature of the CNT composites . For example, Luo et al demonstrated that without carbon nanofiber (CNF) reinforcement, epoxy matrix can withstand around 30% strain before failure but the strain at failure decreased to below 5% after incorporating CNF .…”
Section: Resultsmentioning
confidence: 99%
“…(b) The shrinking recovery process of PPDO-PCL fiber in an animal would around body temperature [31] PTMEG链段的晶区和处于玻璃态的PPDO链段无定 酸酯加入量进行精确控制. 最近, 本课题组 [40,41] 报道 了一种采用丁二酸、丁二醇和双端羟基PEG通过直接 酯化和缩合制备以PBS为硬段、PEG为软段的PBSEG 图 2 多嵌段共聚物 PPDO 9.9 -PTMEG 2.9 -85/15 分别在 20 ℃ (a) 和 6.5℃(b)固定温度下固定后的回复过程照片 [39] Figure 2…”
Section: (T Transunclassified
“…The recovery process of PPDO 9.9 -PTMEG 2.9 -85/15 at 20C (a) and 6.5C (b), respectively [39] PEG链段在无定形态是相容的 应性 [41] . 在材料制备过程中, 采用原位聚合的方法 Behl和Lendlein [48] 将在SMPs广泛采用的化学交联网 络归纳为以下几种(图4): (1) 直接将分子开关链段通 过网点连接形成的单一交联网络;…”
Section: (T Transunclassified
“…However, they also exist inevitable disadvantages such as low stiffness, which results in a relatively small recovery force under constraint when faced with large mechanical resistance. In order to overcome this problem, a great deal of stiff nano-fillers has been incorporated into polymer matrices to fabricate SMPCs [5]. Gall [6] embedded SiC into shapememory epoxy resin to pursue ceramic enhancement.…”
Section: Introductionmentioning
confidence: 99%