“…In particular, fabrication of a Cu pattern on a PET surface is an essential and indispensable characteristic for applications of flexible electronics. It is also noted that in most reports the introduction of active groups, the adsorption of catalytic centers, and electroless plating (a three-step process) are the common technology methods used. − Huang et al, Wang et al, and Chang et al have found that the modified PET surface with −NH 2 and −SH on its surface could absorb Ag particles, such that the Cu coatings are deposited through a REDOX reaction in the presence of catalytic centers. Generally, the catalyst particles, such as Au, Pd, Ag, and so on, are adsorbed and then anchored on the surface of the modified substrate through a coordinate bond.…”