2020
DOI: 10.1016/j.cej.2019.123199
|View full text |Cite
|
Sign up to set email alerts
|

A facile process to fabricate metal coating on PET sheet: Preparation of highly active polymer brush/Ag particle and its application in electroless copper plating

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
42
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
8

Relationship

2
6

Authors

Journals

citations
Cited by 49 publications
(43 citation statements)
references
References 23 publications
1
42
0
Order By: Relevance
“…Compared with Figure 2(b) and 2(c), the copper plating had coated porous and multilayered copper film on the anodic oxidation film when Cu particles were plated on the surface. 19 The micromorphology of MAC was still smooth in 20,000×, but the PHB morphology could be observed on the MACP. Figure 2(e) could demonstrate the surface of magnesium containing PHB, Cu and MgO.…”
Section: Resultsmentioning
confidence: 93%
See 1 more Smart Citation
“…Compared with Figure 2(b) and 2(c), the copper plating had coated porous and multilayered copper film on the anodic oxidation film when Cu particles were plated on the surface. 19 The micromorphology of MAC was still smooth in 20,000×, but the PHB morphology could be observed on the MACP. Figure 2(e) could demonstrate the surface of magnesium containing PHB, Cu and MgO.…”
Section: Resultsmentioning
confidence: 93%
“…In the XPS results, the elemental valence state of PHB on the material surface was like the previous research results. 28 As the results of scratch adhesion test, 19 the structure of the Cu film could adsorb more PHB on the surface, and greatly enhance the adhesion strength of PHB film and the basic magnesium, which could effectively improve the stability of the magnesium alloy during the degradation process. And the result was consistent with the surface morphology.…”
Section: Discussionmentioning
confidence: 99%
“…In particular, fabrication of a Cu pattern on a PET surface is an essential and indispensable characteristic for applications of flexible electronics. It is also noted that in most reports the introduction of active groups, the adsorption of catalytic centers, and electroless plating (a three-step process) are the common technology methods used. Huang et al, Wang et al, and Chang et al have found that the modified PET surface with −NH 2 and −SH on its surface could absorb Ag particles, such that the Cu coatings are deposited through a REDOX reaction in the presence of catalytic centers. Generally, the catalyst particles, such as Au, Pd, Ag, and so on, are adsorbed and then anchored on the surface of the modified substrate through a coordinate bond.…”
Section: Introductionmentioning
confidence: 99%
“…Generally, the catalyst particles, such as Au, Pd, Ag, and so on, are adsorbed and then anchored on the surface of the modified substrate through a coordinate bond. There are many ways of programming catalytic-center-adsorbed substrates, and almost all of them are reasonably simple to implement. ,,, However, the design of interfacial characterization of a catalyst particle is a difficult thing to achieve.…”
Section: Introductionmentioning
confidence: 99%
“…The development of electroless plating has drawn extensive attention mainly because it is a simple and promising method to prepare surface-metallization material [1,2]. Metal particles, such as Ag [3], Cu [4] and Ni [5], in-situ plated on substrate surface with excellent interfacial characterization and dispersion, which meet all the requirements on filler of antistatic coating [6]. The key of the electroless plating reaction is the establishment of catalytic site on polymer surface, so that the plating metal ions were catalyzed reduction metal coating process of formation [7,8].…”
Section: Introductionmentioning
confidence: 99%