A Facile Way of Enhancing Thermal Conduction in Epoxy-Based Nanocomposites via Construction of Well-Defined Hybrid Filler Networks Using a Magnetic Field

Jia, Ning; Yang, Bin; Wang, Xiaohong; Wang, Hao; Liu, Shuqing; Xia, Ru; Kang, Soon-Il; Shen, Junyao; Qian, Jiasheng; Ke, Yuchao; Yang, Piaoping; Fang, Yirong

doi:10.1021/acs.iecr.3c00625

Cited by 6 publications

(2 citation statements)

References 52 publications

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“…As can be seen from Figure 5A, W4 had the highest dielectric constant, since there existed a perfect conductive path constructed by PDA-Ni@GNS in W4. 35 Because PDA-Ni@GNS formed an effective bridging path in the CNF-C/PDA-Ni@GNS composite film, CNF-C/PDA-Ni@GNS composite film also exhibited higher electrical conductivity (cf. Figure 5C).…”

Section: Dielectric Propertiesmentioning

confidence: 99%

Carboxylated cellulose composite film fabricated via layer‐by‐layer self‐sssembly for thermal management material with ultra‐high thermal conductivity

Yang,

Wang,

et al. 2024

Polymer Composites

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With the development of 5G equipment, aerospace, sensors, thermal management devices and other fields in the direction of high power, high performance and miniaturization, the heat released during usage increases significantly, leaving great application prospects for heat dissipation materials. In spite of great attention paid to film materials due to their light weight and flexibility, they have the obvious disadvantage of poor thermal conductivity. In this work, carboxylated cellulose (CNF‐C)/dopamine‐coated nickel‐coated graphene (PDA‐Ni@GNS) composite films with high in‐plane thermal conductivity (in‐plane TC) have been fabricated by a simple vacuum‐assisted filtration method. In the prepared composite films, the flaky packing layers were found to be stacked orderly and form an excellent thermally conductive network, resulting in an increase in in‐plane TC by 322.1% (sample W4) as compared with that of neat films. By comparing the in‐plane TCs of the composite films with that of a commercial gasket, it was readily seen that the present composite films had fairly excellent heat dissipation properties. The composite exhibits not only sufficiently high in‐plane TC and tensile strength of 149.02 MPa but also exhibits hydrophobic property, imparting the composite films good working stability under extreme conditions, which ensured of their potential applications in thermal management materials.Highlights The introduction of Ni promotes the construction of heat conduction path. High in‐plane TC is obtained through layer‐by‐layer self‐assembly. The modification of filler enhanced the mechanical properties of the films. The modification of fillers led to the hydrophobicity of the film. The introduction of PDA made the films have insulating properties.

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Section: Dielectric Propertiesmentioning

confidence: 99%

Carboxylated cellulose composite film fabricated via layer‐by‐layer self‐sssembly for thermal management material with ultra‐high thermal conductivity

Yang,

Wang,

et al. 2024

Polymer Composites

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“…Jia et al 65 fabricated EP NC with Co@graphene nanoplatelets as fillers. Co‐NPs were introduced into the graphene nanoplatelets by electroless plating.…”

Section: Recent Developments In Emi Shieldingmentioning

confidence: 99%

Review on recent progress in epoxy‐based composite materials for Electromagnetic Interference(EMI) shielding applications

Albert,

Parthasarathy,

Kumar

2023

Polymer Composites

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The densely packed electronic components in electronic devices emit electromagnetic (EM) radiations, and the interaction of the emitted EM radiations with external EM signals of neighboring components leads to device malfunctions and also creates health issues in human beings. Particularly, in aircraft, EM interference is a serious threat that leads to disastrous outcomes. The shielding of electronic components is an ideal way to reduce the pollution of electromagnetic interference (EMI). The mechanism of EMI shielding efficiency is discussed elaborately in this article. The factors associated with the EMI shielding of materials are discussed in detail. The EMI shielding by reflection and absorption are two possible routes to improve the shielding performance of the shielding materials. This article also highlights the EMI shielding mechanisms by reflection and absorption. However, the risk of secondary EM pollution is associated with the reflection of EM waves. This review also outlines the methods to improve the absorption‐based shielding performance of the materials. The significance of the microstructure of the shielding materials in enhancing the absorption‐dominant shielding efficiency is also presented with a detailed analysis. This helps to fabricate the absorption‐dominant EMI shielding materials with suitable microstructures. The EM loss is associated with the magnetic, dielectric, and conduction losses according to EM theory.Highlights This article highlights the recent progress in epoxy‐based EMI shielding materials. EMI shielding mechanisms by reflection and absorption are discussed elaborately. Reviewed the methods to improve the absorption‐based shielding performance in detail. Materials with EMI shielding efficiency greater than 30 dB are highly preferable.

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Novel phase‐change PDA‐Ni@GNS/CNF‐C/SA/PEG composites with ultrahigh shape stability and latent heat as thermal management material for microelectronic devices

Wang,

Yang,

Zhang

et al. 2024

J of Applied Polymer Sci

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Phase‐change materials (PCMs) have become a hot spot in the development of modern thermal management materials because of their absorbing and releasing heat while keeping the temperature constant during phase change process. However, their relatively low thermal conductivity (TC) considerably restricts their further application. In this work, graphene nanosheets (GNS) were initially nickel‐plated to increase the contact area between adjacent GNS (in the form of Ni@GNS) by constructing a “point‐surface” structure. Then, the prepared Ni@GNS was coated with polydopamine (PDA) to prepare PDA‐Ni@GNS, which helped to effectively reduce the interface thermal resistance (ITR) between the filler and the matrix, and also made the prepared filler more easily dispersed in the polymer matrix. By constructing well‐defined three‐dimensional (3D) thermally conductive pathways in the matrix, the PCMs exhibited excellent TC and effectively prevented the leakage of polyethylene glycol (PEG) even at low filler loading. The results of thermogravimetry (TG), differential scanning calorimeter (DSC), and cyclic DSC tests jointly showed that the PDA‐Ni@GNS/CNF‐C/SA/PEG PCMs displayed excellent thermal storage properties, high latent heat as well as good cyclic thermal stability. The present study provides a facile way of preparing PEG‐based PCMs, which are applicable in thermal management area.

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A Facile Way of Enhancing Thermal Conduction in Epoxy-Based Nanocomposites via Construction of Well-Defined Hybrid Filler Networks Using a Magnetic Field

Cited by 6 publications

References 52 publications

Carboxylated cellulose composite film fabricated via layer‐by‐layer self‐sssembly for thermal management material with ultra‐high thermal conductivity

Carboxylated cellulose composite film fabricated via layer‐by‐layer self‐sssembly for thermal management material with ultra‐high thermal conductivity

Review on recent progress in epoxy‐based composite materials for Electromagnetic Interference(EMI) shielding applications

Novel phase‐change PDA‐Ni@GNS/CNF‐C/SA/PEG composites with ultrahigh shape stability and latent heat as thermal management material for microelectronic devices

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