2020 IEEE International Symposium on Circuits and Systems (ISCAS) 2020
DOI: 10.1109/iscas45731.2020.9180559
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A FoM of −191 dB, 4.4-GHz LC-VCO Integrating an 8-Shaped Inductor with an Orthogonal-Coupled Tail-Filtering Inductor

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Cited by 6 publications
(3 citation statements)
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“…With utilizing special layout techniques (e.g. Horizontal Parallelization [38], Slicing [39], Tapering [40], Equal Path Lengths (EPL) [41], Patterned Ground Shield (PGS) [42], [43] and others), the inductor properties can be optimized to comply with requirements in these technologies as well [8], [20], [22]- [24]. These techniques can effectively suppress undesirable parasitic effects present in on-chip inductors caused mostly by high frequency signal (e.g.…”
Section: A Standard General Purpose Technologiesmentioning
confidence: 99%
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“…With utilizing special layout techniques (e.g. Horizontal Parallelization [38], Slicing [39], Tapering [40], Equal Path Lengths (EPL) [41], Patterned Ground Shield (PGS) [42], [43] and others), the inductor properties can be optimized to comply with requirements in these technologies as well [8], [20], [22]- [24]. These techniques can effectively suppress undesirable parasitic effects present in on-chip inductors caused mostly by high frequency signal (e.g.…”
Section: A Standard General Purpose Technologiesmentioning
confidence: 99%
“…Table II summarizes key parameters of the selected on-chip inductors implemented and published within the last 4 years. Inductors were fully integrated and evaluated by measurements except for structures in [8], [23] and [24]. These three structures were evaluated only by simulation but achieved interesting results in standard general purpose cost effective technologies without any post-CMOS process steps, where achieved values of inductance densities were L A = 150.6 nH/mm 2 , L A = 32.292 nH/mm 2 and L A = 24.015 nH/mm 2 , and the maximum quality factor (Q max ) values of 15.6, 3.1 and 6 were reported.…”
Section: Overviewmentioning
confidence: 99%
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