A Fully-Integrated Flexible Photonic Platform for Chip-to-Chip Optical Interconnects

Li, Lan; Zou, Yi; Lin, Hongtao; Hu, Juejun; Sun, Xiaochen; Feng, Ning‐Ning; Danto, Sylvain; Richardson, Kathleen; Gu, Tian; Haney, Michael W.

doi:10.1109/jlt.2013.2285382

Cited by 61 publications

(36 citation statements)

References 32 publications

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“…The SU-8 membrane can be delaminated from the handler substrate after detector fabrication to form free-standing flexible devices. This process, which has previously been adopted for flexible ChG photonic device fabrication by the authors [61][62][63][64][65] , capitalizes on the low deposition and processing temperatures of ChG's to facilitate direct integration on polymers which typically cannot withstand temperatures above 250 °C. The Ge23Sb7S70 glass waveguide dimensions are as follows: ridge width 0.8 m, slab thickness 0.13 m and ridge height 0.3 m.…”

Section: Section XII -Fabrication and Characterization Of Flexible Wamentioning

confidence: 99%

Chalcogenide glass-on-graphene photonics

et al. 2017

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Two-dimensional (2-D) materials are of tremendous interest to integrated photonics given their singular optical characteristics spanning light emission, modulation, saturable absorption, and nonlinear optics. To harness their optical properties, these atomically thin materials are usually attached onto prefabricated devices via a transfer process. In this paper, we present a new route for 2-D material integration with planar photonics. Central to this approach is the use of chalcogenide glass, a multifunctional material which can be directly deposited and patterned on a wide variety of 2-D materials and can simultaneously function as the light guiding medium, a gate dielectric, and a passivation layer for 2-D materials. Besides claiming improved fabrication yield and throughput compared to the traditional transfer process, our technique also enables unconventional multilayer device geometries optimally designed for enhancing light-matter interactions in the 2-D layers. Capitalizing on this facile integration method, we demonstrate a series of highperformance glass-on-graphene devices including ultra-broadband on-chip polarizers, energyefficient thermo-optic switches, as well as graphene-based mid-infrared (mid-IR) waveguideintegrated photodetectors and modulators.

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Section: Section XII -Fabrication and Characterization Of Flexible Wamentioning

confidence: 99%

Chalcogenide glass-on-graphene photonics

et al. 2017

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“…Some ChG applications (i.e. diffraction gratings, waveguides) require the material to be in thin film form [4,5,[7][8][9][10][11][12]. Current standard methods for thin film deposition of ChG include thermal evaporation, sputtering, pulsed laser deposition and spin-coating [13,14].…”

Section: Introductionmentioning

confidence: 99%

Structural features of spin-coated thin films of binary AsS− chalcogenide glass system

et al. 2015

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Spin-coating technology offers a convenient method for fabricating photostable chalcogenide glass thin films that are especially attractive for applications in IR optics. In this paper we report the structure of spin-coated As x S 100 − x (x = 30, 35, 40) thin films as determined using high resolution X-ray photoelectron spectroscopy (XPS) and Raman spectroscopy, especially in relation to composition (i.e. As/S ratio) and preparation process variables. It was observed that As atoms during preparation have a tendency to precipitate out in close to stoichiometric compositions. The mechanism of bonding between the inorganic matrix and organic residuals is discussed based on the experimental data. A weak interaction between S ions and amine-based clusters is proposed as the basis of structural organization of the organic-inorganic interface.

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“…The coupling of light between chips and light sources contributes to a considerable portion of the total link budget for any low-power optical modulator approach, and therefore has to be realized via an efficient and compact method [23]- [27].…”

Section: Integrated Optical Fabricsmentioning

confidence: 99%

Chip-Level Multiple Quantum Well Modulator-Based Optical Interconnects

Nair

Haney

2013

J. Lightwave Technol.

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High performance computing systems are becoming increasingly limited by the capacity of interconnects due to the continued scaling down of CMOS critical dimensions, resulting in the implementation of optical interconnects at ever decreasing distances. At the chip level, the communication bottleneck and energy consumption per bit are now major limitations to the continued performance scaling of microprocessors. In this paper, a novel integrated photonic approach is presented that uses polymer waveguides and surface-normal GaAs/AlAs multiple quantum well devices integrated directly onto a silicon chip. The concept provides sub-pJ/b performance and seamless interfacing between the on-and off-chip domains. This is the first demonstrated waveguide-coupled surface-normal MQW-based approach to be fully integrated within a photonic layer and to a large extent mitigates packaging issues for future photonics systems integrated with Si chips. Key aspects of the architecture are efficient and minimum-footprint optical fabrics and low-power-consuming optical transceivers. Gray-scale lithography is used to fabricate the 3-D coupling structures directly in the waveguide polymer layer. Analyses and experimental results show that the optical fabric concept provides the necessary bandwidth density and low power consumption for future chip-scale interconnections.Index Terms-Multiple quantum well modulators, optical interconnects, optical waveguides, photonic integrated circuits.

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A Fully-Integrated Flexible Photonic Platform for Chip-to-Chip Optical Interconnects

Cited by 61 publications

References 32 publications

Chalcogenide glass-on-graphene photonics

Chalcogenide glass-on-graphene photonics

Structural features of spin-coated thin films of binary AsS− chalcogenide glass system

Chip-Level Multiple Quantum Well Modulator-Based Optical Interconnects

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