2016 21st International Conference on Microwave, Radar and Wireless Communications (MIKON) 2016
DOI: 10.1109/mikon.2016.7492014
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A GaN MMIC chipset suitable for integration in future X-band spaceborne radar T/R module Frontends

Abstract: A set of monolithic microwave integrated circuits (MMICs) has been successfully developed by using a qualified European GaN HEMT technology. In particular a high power amplifier (HPA), a low noise amplifier (LNA) and a single pole double throw (SPDT) switch have been designed, manufactured and tested. The presented chipset is very suitable for integration in future GaN-based T/R module Frontend for spaceborne Xband SAR applications. In particular, the MMIC HPA integrates two stages of gain in 5.5 x 4.0 mm2 of … Show more

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Cited by 21 publications
(6 citation statements)
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“…We point out that the aero-GaN samples are able to cover an entire monolithic microwave integrated circuit (MMIC), which has overall dimensions smaller than or comparable to our samples, depending on its application and output power. For example, our aero-GaN samples have the area of 288 mm 2 , while the surface of an advanced MMIC T/R module, dedicated to space borne radar in the X-band and made of two stages power amplifier, three-stage low noise amplifier and MMIC SPDT switches, has a total area of 230 mm 2 [23].…”
Section: Discussionmentioning
confidence: 99%
“…We point out that the aero-GaN samples are able to cover an entire monolithic microwave integrated circuit (MMIC), which has overall dimensions smaller than or comparable to our samples, depending on its application and output power. For example, our aero-GaN samples have the area of 288 mm 2 , while the surface of an advanced MMIC T/R module, dedicated to space borne radar in the X-band and made of two stages power amplifier, three-stage low noise amplifier and MMIC SPDT switches, has a total area of 230 mm 2 [23].…”
Section: Discussionmentioning
confidence: 99%
“…The characteristic impedance is calculated and tuned deliberately with the Momentum EM simulation in ADS. In previous works, several k-Ohm resistors were used to decouple the switch circuit from the common gate ground [ 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. However, the gate leakage current combined with a high-value resistor induces a distinctive change to the effective control voltage, which can result in a huge degradation in the overall performance of the switch, specifically for the on-state HEMT as it can change state from on- to off-state.…”
Section: X-band Transceiver Front-end Designmentioning
confidence: 99%
“…While GaAs pseudomorphic HEMTs (pHEMTs), characterized by low operating voltage, high electron mobility, and high maximum operating frequency, are actively used in transceiver modules, they require the application of additional limiters to block leaked power from the transmitter and to protect the receiver circuit from unwanted highinput power, which adversely affects both the size reduction of the module and the necessary low-noise performance. This drawback has contributed to a recent research trend focused on using GaN HEMTs on SiC in the receiver module [3][4][5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%