“…. Commonly used configurations of suspended MEMS transmission-line structures: (a) microshield structure with two bonded wafers and backside through-wafer etching [7]; (b) single-wafer frontside-etched microshield structure with vias on a thin membrane [8]; (c) single-wafer frontside-etched microshield structure without membrane; (d) suspended structure with/without dielectric support posts [21]; (e) fixed-fixed beam switch; and (f) down-state cantilever beam switch. and there is a wide variety of other RF microelectromechanical systems (MEMS) devices incorporating their structures, including LC passives [10], [11], filters [12], [13], power dividers [14], [15], mixers [16], [17], varactors [18], [19], couplers [20], [21], phase shifters [22], [23], resonators [24], [25], diplexers [24], oscillators [1], [24], parametric amplifiers [26], impedance tuners [27], [28], frequency selective surfaces [29], [30], and antennas [31], [32].…”