Thermal-aware°oorplanning is an e®ective way to solve the thermal problem in modern integrated circuit (IC) designs. Existing thermal-aware°oorplanning methods are all based on simulated annealing (SA), genetic algorithms (GAs) or linear programming (LP), which are quite time-consuming. In this paper, we propose two fast algorithms for thermal-aware°oorplanning, a greedy algorithm based on the less-°exibility-¯rst (LFF) principle and a hybrid algorithm combining the greedy algorithm and an SA-based re¯nement. The greedy algorithm can fast obtain a locally optimized°oorplan with reduced area and temperature. The hybrid method can get similar results compared with pure SA-based approaches but it is still much faster.