A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Drummond, Kevin P.; Back, Doosan; Sinanis, Michael D.; Janes, David B.; Peroulis, Dimitrios; Weibel, Justin A.; Garimella, Suresh V.

doi:10.1016/j.ijheatmasstransfer.2017.10.015

Cited by 298 publications

(53 citation statements)

References 45 publications

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“…The coating technique that cover on top of VACNT before complete the TIMs assembly has gained attention from other researchers when dealing with VACNT and found that the coating will help on reducing thermal contact resistance, increasing surface contact between VACNT and heat sink, and maintaining the optimum thermal conductivity . In addition, the reliability of the thermal performance of TIMs is an important factor to be considered.…”

Section: Carbon Allotrope Materials In Tims Applicationmentioning

confidence: 99%

“…81 The coating technique that cover on top of VACNT before complete the TIMs assembly has gained attention from other researchers when dealing with VACNT and found that the coating will help on reducing thermal contact resistance, increasing surface contact between VACNT and heat sink, and maintaining the optimum thermal conductivity. 80,[88][89][90] In addition, the reliability of the thermal performance of TIMs is an F I G U R E 6 SEM image of VACNT using PE-CVD 4,83 SEM, scanning electron microscopy; PE-CVD, plasmaenhanced chemical vapor deposition; VACNT, vertically aligned carbon nanotube important factor to be considered. Nylander et al 89 observed the thermal resistance within 100 cycles, where thermal performance was degraded.…”

Section: Carbon Nanotubesmentioning

confidence: 99%

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Allotrope carbon materials in thermal interface materials and fuel cell applications: A review

2019

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Summary The performance of allotrope carbon materials has been explored because of their superior properties in energy system applications. This review provides an understanding of the current work focusing on the applications of selected carbon materials in important energy systems, focus on thermal interface materials (TIMs), and fuel cell applications. This article begins with the introduction of TIMs and fuel cell in general working principle and presents details on carbon materials. The discussion focuses on updates from the latest research work and addresses current challenges and opportunities for research toward TIMs and fuel cell applications. The optimum performance of TIMs was seen when thermal conductivity achieved at a maximum of 3000 W (m K)−1 by using vertically aligned carbon nanotubes (CNTs) and a minimum internal thermal resistance of 0.3 mm2 K W−1. Meanwhile for fuel cell, the platinum/CNTs catalyst applied proton exchange membrane fuel cell achieved high power density of 661 mW cm−2 in the presence of Nafion electrolyte membrane. This review provides insights for scientists about the use of carbon materials, especially in energy system applications.

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Section: Carbon Allotrope Materials In Tims Applicationmentioning

confidence: 99%

Section: Carbon Nanotubesmentioning

confidence: 99%

Allotrope carbon materials in thermal interface materials and fuel cell applications: A review

2019

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“…Indeed, high computational power and fast responsiveness generate heat that needs to be dissipated. Heat sinks with brush architecture are one common strategy but require expensive and time‐consuming fabrication . Exploring composite structures using highly thermally conductive particles or ballistic modes for heat dissipation would also push forward the application scope of electronic devices …”

Section: Discussionmentioning

confidence: 99%

3D Assembly of Graphene Nanomaterials for Advanced Electronics

Ferrand

Chabi

Agarwala

2020

Advanced Intelligent Systems

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Since the discovery of electricity and the creation of the first transistors two centuries ago, the field of electronics has evolved rapidly to become omnipresent. Today, electronic devices are challenged by new demands in function and performance: they are expected to be lightweight, highly efficient, flexible, smart, implantable, and so on. To meet these demands, the materials and components in devices need to be carefully selected and assembled together. In this regard, the controlled assembly of 3D graphene structures holds tremendous potential to achieve such levels of multifunctionality and outstanding properties. Advanced processing approaches, such as 3D printing, allow the fabrication of a variety of 3D graphene–based materials that present outstanding properties and a high degree of multifunctionality. Herein, the recent progress in the fabrication of graphene‐based devices for advanced electronics using controlled assembly is reported. The benefits of controlling the microstructure of graphene nanomaterials for enhanced properties and functionalities are highlighted, and the various fabrication methods and their implications on the organization of materials are reviewed, as well as selected electrical devices. The approaches described here are opening up new avenues for the fabrication of health or structural monitoring devices, autonomous machines, and interconnected objects.

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“…A peak heat flux of 326 W/cm 2 was obtained using R134a at 16% thermodynamic outlet vapor quality. Drummond et al [11,12] tested a manifoldmicrochannel array of 15 lm wide by 300 lm deep microchannels. Mass fluxes ranging between 1300 and 2070 kg/m 2 s and thermodynamic outlet vapor qualities between À7% and 30% were tested.…”

Section: Literature Surveymentioning

confidence: 99%

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Mandel

Bae

Ohadi

2018

Journal of Electronic Packaging

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The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and pumping power. To achieve maximum benefit, high heat fluxes and vapor qualities should be achieved simultaneously. While many researchers have achieved heat fluxes in excess of 1 kW/cm2, vapor qualities are often below 10%, requiring a significantly large amount of energy spent on subcooling or pumping power, which minimizes the benefit of using two-phase thermal transport. In this work, we describe our recent work with cooling devices utilizing film evaporation with an enhanced fluid delivery system (FEEDS). The design, calibration, and experimental testing of a press-fit and bonded FEEDS test section are detailed here. Heat transfer and pressure drop performance was characterized and discussed. With the press-fit Si test chip, heat fluxes in excess of 1 kW/cm2 were obtained at vapor qualities approaching 45% and a coefficient of performance (COP) approaching 1400. With the bonded SiC test chip, heat fluxes in excess of 1 kW/cm2 were achieved at a vapor quality of 85% and heat densities approaching 490 W/cm3.

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A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Cited by 298 publications

References 45 publications

Allotrope carbon materials in thermal interface materials and fuel cell applications: A review

Allotrope carbon materials in thermal interface materials and fuel cell applications: A review

3D Assembly of Graphene Nanomaterials for Advanced Electronics

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

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