A High-Capacity Digital Communication System Using TE/sub 01/ Transmission in Circular Waveguide

Abele, T. A.; Alsberg, D. A.; Hutchison, P. T.

doi:10.1109/tmtt.1975.1128565

Cited by 22 publications

(5 citation statements)

References 8 publications

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“…For example, when b = 5 mm, there exist 17 possible even-symmetric TE modes (TE 1 , TE 3 , TE 5 , TE 7 , ….., and TE 33 ) having cutoff frequencies that lie within our input spectrum. However, similar to the earlier study [19], this problem can be overcome if the input coupling is optimized to selectively excite only the TE 1 mode via mode matching. In fact, the electric field of the TE 1 mode has a spatial dependence of E͑y͒ϳsin͑y / b͒, where y is the coordinate normal to the plates with the origin at the plate surface.…”

Section: ͑1͒mentioning

confidence: 82%

“…The idea of shifting f c to the low-frequency end by increasing the plate separation has not been explored previously for the PPWG, but a similar concept has been studied for the transport of microwave radiation in a hollow metallic circular waveguide, in the 1970's [19]. In that case, as in our situation, one encounters the obvious disadvantage of permitting multimode propagation, resulting in an over-moded waveguide.…”

Section: ͑1͒mentioning

confidence: 98%

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An investigation of the lowest-order transverse-electric (TE_1) mode of the parallel-plate waveguide for THz pulse propagation

2009

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We experimentally and theoretically investigate the lowest-order transverse-electric ͑TE 1 ͒ mode of the parallel-plate waveguide (PPWG) for the propagation of broadband THz pulses. We demonstrate undistorted THz pulse propagation via the single TE 1 mode, solving the group-velocity-dispersion and spectral-filtering problems caused by the mode's low-frequency cutoff. We observe a remarkable counterintuitive property of the TE 1 mode: its attenuation decreases with increasing frequency for all frequencies above cutoff. This phenomenon has not been observed with any other THz waveguide to date, and it can enable extremely low-loss propagation. We present a physical interpretation of this frequency-dependent behavior using a simple plane-wave description of the TE 1 mode propagation. We also find that it is possible to achieve almost 100% coupling to the TE 1 mode from a focused free-space Gaussian beam. In addition, using the above plane-wave analysis, we show how to mitigate the diffraction losses inherent to long path-length PPWGs via the use of transverse-concave plates.

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Section: ͑1͒mentioning

confidence: 82%

Section: ͑1͒mentioning

confidence: 98%

An investigation of the lowest-order transverse-electric (TE_1) mode of the parallel-plate waveguide for THz pulse propagation

2009

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“…In 1974, the H 01 mode of a 38 GHz millimeter wave, guided by a 7 cm diameter pipe buried under ground, was shown to support a 640 Mb/s data bandwidth in a 5 km run [7]. Subsequent experiments with 6 cm diameter pipes and the lower loss TE 01 mode, with control sections to prevent mode conversion, demonstrated a loss of less than 1 dB/km over a 20 km section of waveguide in the frequency band from 40 to 120 GHz [8]. With guard bands and control/maintenance channels the trunk line had sufficient available bandwidth to carry 120 duplex channels, each channel having a capacity of 274 Mb/s.…”

Section: Data Channel Design and Form Factor Considerationsmentioning

confidence: 93%

“…With guard bands and control/maintenance channels the trunk line had sufficient available bandwidth to carry 120 duplex channels, each channel having a capacity of 274 Mb/s. The pipe could carry the equivalent of about 230,000 two-way voice channels [8].…”

Section: Data Channel Design and Form Factor Considerationsmentioning

confidence: 99%

Low latency high throughput memory-processor interface

Wang

Guidotti

Lin

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

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Scaling to ExaFLOPS computing, or 100 times faster than the present version of the Fujitsu K-supercomputer, presents well known challenges, among which are power dissipation, memory capacity and access bandwidth, data locality and fault tolerance. The optimum Amdahl's speed-up strategy is multi faceted, with greater memory bandwidth and lower access latency being generally recognized as areas to improve. To this end, evolutionary compute node architecture is considered based on a multichip interposer platform and a millimeter wave memory interface. The interposer serves as the compute node physical platform and wiring distribution layer connecting the chip multiprocessor (CMP) with oninterposer memory to an organic board. For example, the interposer may be composed of glass to reduce through-via parasitic and support one multi-GFLOPS CMP with sufficient on-interposer DRAM for balanced operation. The memory interface consists of dense arrays of millimeter waveguide with integrated mm wave transceivers and should support 40 Gb/s per channel for an aggregate throughput of 1 TB/s with estimated latency of 10-15 clock cycles. This paper examines channel impediments, design and construction. Data transmission on a 72 GHz carrier frequency and 12 Gb/s OOK modulation will be presented at the conference if available. I. IntroductionHaving many compute cores on a single die has many advantages, among which are multithreading and reduced power dissipation per unit area, the latter being, in part, due to increasing die size to accommodate greater shared Cache volume, lower clock rates and a lower density of global interconnects. On the down side, within a CMP there arises contention among cores for on-die resources such as shared Cache, access to the inter-core bus, the router I/O interface and to one or more interfaces to main memory. The latter being significant for frequent Cache misses as a reload carries a latency penalty of 180 to 200 clock cycles and can significantly affect CMP performance [1]. The interface to main memory is based on legacy copper bus and legacy FR-4 polymer board technology. There is no alternative at this time. As the range of the high performance memory interface is about 7 cm [2] the volume of main memory that can be packed within this range and outside the CMP cooling package is limited and will lead to a memory-starved processor and lower performance. To prevent this occurrence, a FLOPS-to-Byte ratio greater than 1 should be maintained, depending on available Cache and type of computations. At least 1 Byte of memory should be accessible for each (64 bit) FLOP per second. Lower reload latencies are beneficial. To achieve these operating conditions, a different compute node architecture and main memory interface is proposed.The basic compute node architectures for all modern computers is based on localized logic plus arithmetic functional units supported by multiple data storage units having various intrinsic capacities and latencies. Data and operating instructions are transported from storage ...

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“…millimeter waves were envisioned to provide cost-effective, metropolitan area network (MAN) trunk-level telecommunication [9]. The basic idea was simple.…”

mentioning

confidence: 99%

Arrays of millimeter-wave silicon waveguides for interchip communication on glass interposer

Wang

Guidotti

Cao

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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High capacity, guided, millimeter wave communication between integrated circuits is investigated with emphasis on a glass interposer integrated architecture. Silicon rectangular waveguides with integrated internal probes are designed both from the point of view of circuit theory and antenna theory in the presence of a sub cutoff wavelength backwall taper. Simulation results are compared with vector network analyzer results up to 110 GHz.

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A High-Capacity Digital Communication System Using TE/sub 01/ Transmission in Circular Waveguide

Cited by 22 publications

References 8 publications

An investigation of the lowest-order transverse-electric (TE_1) mode of the parallel-plate waveguide for THz pulse propagation

An investigation of the lowest-order transverse-electric (TE_1) mode of the parallel-plate waveguide for THz pulse propagation

Low latency high throughput memory-processor interface

Arrays of millimeter-wave silicon waveguides for interchip communication on glass interposer

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