International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)
DOI: 10.1109/iedm.2001.979476
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A high performance 0.13 μm SOI CMOS technology with a 70 nm silicon film and with a second generation low-k Cu BEOL

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Cited by 5 publications
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“…Going to thinner films has a noticeable impact on device performance. This is shown in Figure 10, based on the results of our secondgeneration 0.13-m SOI CMOS, where the ring performance improves as the film thickness is reduced [20].…”
Section: Figurementioning
confidence: 93%
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“…Going to thinner films has a noticeable impact on device performance. This is shown in Figure 10, based on the results of our secondgeneration 0.13-m SOI CMOS, where the ring performance improves as the film thickness is reduced [20].…”
Section: Figurementioning
confidence: 93%
“…Measured impact of SOI film thickness on total C J and ring performance. Reproduced with permission from [20]…”
Section: Figure 10mentioning
confidence: 99%
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“…Commercial interest in SOI is increasing at least in part due to its reduced parasitic capacitances and therefore potential for high-speed operation [5]. On the other hand, just as in conventional CMOS [6], any reduction in node capacitance has the potential to lower the charge needed to cause an upset, thereby increasing the sensitivity of circuits to radiation induced disturbances.…”
Section: Introductionmentioning
confidence: 99%