A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems

Abstract

A new and innovative interconnection technology applicable for printed circuit boards is presented. This technology is widely compatible with the existing design and manufacturing processes and technologies for conventional multilayer pc boards and it combines electrical and optical interconnects on pc board level. It provides the potential for on-board bandwidth of several Gb/s and closes the bottleneck caused by the limited performance of electrical interconnection technology. After giving an overview on the most important basic technologies and first available results and engineering samples, the focus of this paper is on the development of appropriate modeling methodologies and simulation algorithms necessary for designing and optimizing optical on-board interconnects within the conventional electrical pc board environment.Index Terms-Board-integrated multimode waveguides, design and modeling of optical multimode interconnects, electrical-optical printed circuit boards, modeling of laser-diodes and photodiodes, optical interconnection technology.

Polymer-based Large Core Optical Splitter for Multimode Optical Networks

“…따라서, 본 논문에서는 저가형, 고효율 공정인 자외선 임프 린트(Ultraviolet imprint, UV-imprint) 공정 [4,5] 을 이용하여 폴리머를 기반으로 하는 멀티모드 신호 분배용 1:1 균등 광 분배기 및 광네트워크 모니터링용 9:1비균등 광분배기를 제 작하였다. UV-imprint 공정을 이용한 폴리머 기반의 광분배 기 제작 방법은 대구경 광도파로 제조 기술에 적합한 기술이 며, 양산시 대량생산이 가능하여 제조 원가를 절감 할 수 있 는 장점이 있다.…”

Very Large Scale Optical Interconnect Systems For Different Types of Optical Interconnection Networks

“…Multiple stage (or multistage) interconnection networks (MINs) offer topological advantages such as scalability and modularity owing to their composition from hundreds or thousands of similar switching node building blocks [2]. In OIN systems, most of the complexity and cost is attributable to the photonic switching elements.…”

Laser ablated coupling structures for optical printed circuit boards

“…The research will evaluate existing and novel optical materials and take advantage of industry standard high-density integration and explore new technologies. While many of the objectives of optical data connections on PCBs have been addressed at length by many groups [1][2][3][4][5][6][7][8], the cost effective manufacturing of coupling structures for guiding light into optical waveguides has still not been solved in a way that would enable optical PCBs reach a state where broad implementation can be expected. Different solutions provide highly parallel optical chip-to-chip data transmission [7]; other solutions provide interconnections based on MT ferrule design [9].…”