This paper suggests an optical printed circuit board (OPCB) having new optical coupling structures, including a laser-drilled and under-filled structure (LD-UFS) and a vertical waveguide structure (VWS). The suggested OPCB has the features of high-speed data transmission as well as highly efficient optical coupling because it was fabricated with low-dielectric and transparent electrical PCB materials through a PCB compatible process. To evaluate and compare the optical and electrical performances of the suggested OPCB with those of other OPCBs, the various types of OPCBs were fabricated and measured. The optical coupling losses of the LD-UFS and the VWS were measured with excellent results of 9.8 and 7.8 dB, respectively, which are lower than that of the basic structure. The electrical 3-dB bandwidth of the OPCB was also evaluated up to more than 40 GHz. Downloaded From: http://opticalengineering.spiedigitallibrary.org/ on 05/15/2015 Terms of Use: http://spiedl.org/terms

We describe an ultra-thin and low-power optical interconnect module for mobile electronic devices such as mobile phones and notebooks. The module was fabricated by directly packaging optic and electronic components onto a thin and flexible optical printed circuit board having a size of 70 × 8 × 0.25 mm. The completed active module has features of thinness (0.5 mm), small size (7 × 5 mm), very low total power consumption (15.88 mW), and high data rate transmissions (2.5 Gbps).

In the paper, we fabricated a Ni master with 45°-mirror structures for flexible waveguide fabrication. The flexible waveguide films with embedded 45°-angled mirrors at the waveguide ends were successfully fabricated using a UV-imprint process. Next, in order to enhance the reflectivity of the mirrors, Ni(3 nm)-Au(200 nm) bilayers were evaporated on the 45°-angled facets through a locally opened thin mask using an electron beam evaporator. We measured propagation loss, bending loss, mirror loss and bending reliability of the fabricated waveguide.

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