2022
DOI: 10.3390/nano12234318
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A High-Quality Dopant-Free Electron-Selective Passivating Contact Made from Ultra-Low Concentration Water Solution

Abstract: Crystalline silicon solar cells produced by doping processes have intrinsic shortages of high Auger recombination and/or severe parasitic optical absorption. Dopant-free carrier-selective contacts (DF-CSCs) are alternative routines for the next generation of highly efficient solar cells. However, it is difficult to achieve both good passivating and low contact resistivity for most DF-CSCs. In this paper, a high-quality dopant-free electron-selective passivating contact made from ultra-low concentration water s… Show more

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Cited by 2 publications
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“…TiO x , TiN x , CdS, In 2 S 3 , Cs 2 CO 3 , LiF x , CsF x , MgF x , EuF 3 , CeF x , GdF x , PEI, and Triton X-100 are dopant-free electron-selective contacts (DF-ESCs). These DF-ESCs show adequate carrier selectivity without delicate and harsh doping and can be easily fabricated using straightforward low-temperature procedures such as atomic layer deposition (ALD), spin-coating process, thermal evaporation, and magnetron sputtering. The exploration of DF-CSCs for solar cells gained momentum in 2016 with the achievement of a 19.42% efficiency in a heterojunction solar cell featuring an “a-Si:H­(i)/MoO 3 /ITO front stack layer and a rear a-Si:H­(i)/LiF x /Al configuration” .…”
Section: Introductionmentioning
confidence: 99%
“…TiO x , TiN x , CdS, In 2 S 3 , Cs 2 CO 3 , LiF x , CsF x , MgF x , EuF 3 , CeF x , GdF x , PEI, and Triton X-100 are dopant-free electron-selective contacts (DF-ESCs). These DF-ESCs show adequate carrier selectivity without delicate and harsh doping and can be easily fabricated using straightforward low-temperature procedures such as atomic layer deposition (ALD), spin-coating process, thermal evaporation, and magnetron sputtering. The exploration of DF-CSCs for solar cells gained momentum in 2016 with the achievement of a 19.42% efficiency in a heterojunction solar cell featuring an “a-Si:H­(i)/MoO 3 /ITO front stack layer and a rear a-Si:H­(i)/LiF x /Al configuration” .…”
Section: Introductionmentioning
confidence: 99%