A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing

Huang, Yi-Ren; Kuo, Sheng-An; Stach, Michal; Liu, Chia-Hsing; Liao, Kuan-Hsun; Lo, Cheng‐Yao

doi:10.3390/s120404172

Cited by 11 publications

(8 citation statements)

References 24 publications

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“…The top layer bumps were ignored for simplicity, which did not affect bending behaviors. The air gap decreased in the z-direction when the structure was bent, which confirms previous research results [36]. The simulation results imply a sensitivity change during bending because of the air gap change, which varied the distance between the two electrodes.…”

Section: F Sensitivity With Bendingsupporting

confidence: 91%

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Mutual Capacitive Flexible Tactile Sensor for 3-D Image Control

Wang

Chen

et al. 2013

J. Microelectromech. Syst.

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This study develops a novel mutual capacitive tactile sensor for a touch panel with shifted finger-type electrodes with high sensitivity and other benefits. This tactile sensor detects normal, shear, and pulling forces with good simultaneous visible transmittance and flexibility for the next generation of 3-D flexible portable displays. The tactile sensor is composed of polyethylene terephthalate, gold, indium tin oxide, and polydimethylsiloxane. It exhibits 75% transmittance on average in the visible region, 0.04-N force resolution, and 1.5-pF/N responsiveness. The finger-type electrode design improves sensitivity by 112%-4100%, depending on the number of fingers and shifted direction. This study conducts theoretical calculations, simulations, fabrication, and measurements.[2012-0243]

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Section: F Sensitivity With Bendingsupporting

confidence: 91%

“…The bumps were 10-μm-high hemispheres. Previous studies have used this inkjet process [36] for similar structures. Overlap length in the x-and y-directions was thus carefully controlled.…”

Section: B Processmentioning

confidence: 99%

Mutual Capacitive Flexible Tactile Sensor for 3-D Image Control

Wang

Chen

et al. 2013

J. Microelectromech. Syst.

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“…For a contour line divided into n contour points and a refer ence line equally divided into m reference points, the distance d ij between a contour point P Ci ( x Ci , y Ci ) and a reference point P Rj ( x Rj , y Rj ) can be calculated with (5).…”

Section: Deviation Acquisitionmentioning

confidence: 99%

“…In recent years, printed electronics and its related processes have been developed in different applications from various per spectives including material, structure, and efficiency [1][2][3][4][5]. Among numerous printing techniques such as offset, gravure, or screen printing; inkjet printing boasts many advantages over other techniques in low waste generation, simple pat tern modification, and low cost.…”

Section: Introductionmentioning

confidence: 99%

Efficient and improved qualification method for patterns with irregular edges in printed electronics

Liu

Hsu

et al. 2019

J. Micromech. Microeng.

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This paper reports a proposal for an advanced and efficient method to evaluate the pattern transfer completeness (PTC) in terms of line edge roughness (LER) by quantifying the deviations of printed patterns statistically in regards to their original designed patterns. Three substantial errors in the existing method are corrected by the proposed method with evidence from iterative examinations.With the use of identical images of complex patterns expressible in parametric forms such as Archimedean, logarithmic, and hyperbolic spirals, error corrections and efficiency improvements compared to the existing method are proven. Comprehensive studies for image operation, reference point definition, deviation acquisition, contour point creation, and LER calculation were performed. In addition, this work involves analyses of the errors in the existing method, the efficiency improvement of the proposed method, the impact of variations on point density, and the validity of the LER calculations. The results show that the proposed method not only correctly evaluates the PTC of printed patterns with on average 97.6% efficiency enhancement, with at most 37.7% correctness improvement, but also displayed operation flexibility with the controllable point density in comparison to the existing method.

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“…In reality, fabricating MEMS beams of ideal anchors with the precise intended design dimensions is hard to achieve practically due to fabrication imperfections, such as undercuts near anchors and initial deformation of MEMS beams due to residual stresses. Small deviations from the ideal conditions indeed occur at the ends [ 24 , 25 ]. The concept of non-ideal boundary conditions has been proposed to be applied to micro/nano-resonator systems [ 11 , 26 ].…”

Section: Introductionmentioning

confidence: 99%

Dynamic Characteristics of Micro-Beams Considering the Effect of Flexible Supports

Zhang

Meng

2013

Sensors

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Normally, the boundaries are assumed to allow small deflections and moments for MEMS beams with flexible supports. The non-ideal boundary conditions have a significant effect on the qualitative dynamical behavior. In this paper, by employing the principle of energy equivalence, rigorous theoretical solutions of the tangential and rotational equivalent stiffness are derived based on the Boussinesq's and Cerruti's displacement equations. The non-dimensional differential partial equation of the motion, as well as coupled boundary conditions, are solved analytically using the method of multiple time scales. The closed-form solution provides a direct insight into the relationship between the boundary conditions and vibration characteristics of the dynamic system, in which resonance frequencies increase with the nonlinear mechanical spring effect but decrease with the effect of flexible supports. The obtained results of frequencies and mode shapes are compared with the cases of ideal boundary conditions, and the differences between them are contrasted on frequency response curves. The influences of the support material property on the equivalent stiffness and resonance frequency shift are also discussed. It is demonstrated that the proposed model with the flexible supports boundary conditions has significant effect on the rigorous quantitative dynamical analysis of the MEMS beams. Moreover, the proposed analytical solutions are in good agreement with those obtained from finite element analyses.

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A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing

Cited by 11 publications

References 24 publications

Mutual Capacitive Flexible Tactile Sensor for 3-D Image Control

Mutual Capacitive Flexible Tactile Sensor for 3-D Image Control

Efficient and improved qualification method for patterns with irregular edges in printed electronics

Dynamic Characteristics of Micro-Beams Considering the Effect of Flexible Supports

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