A knowledge-based thermal profile identification advisor for surface mount PCB assembly

Wu, Chien-Hsing; Srihari, K.; McLenaghan, A.J.

doi:10.1007/bf01845693

Cited by 9 publications

(8 citation statements)

References 8 publications

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“…Therefore, the first heating capability examinations of reflow ovens were started with simple temperature distribution measurements [8] and simulations [9,10] (using only two dimensions with low resolution). But we think that nowadays, this is not enough.…”

Section: Introductionmentioning

confidence: 99%

Investigating direction characteristics of the heat transfer coefficient in forced convection reflow oven

Illés

Harsányi

2009

Experimental Thermal and Fluid Science

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Section: Introductionmentioning

confidence: 99%

Investigating direction characteristics of the heat transfer coefficient in forced convection reflow oven

Illés

Harsányi

2009

Experimental Thermal and Fluid Science

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“…In the mid 1990s, some electronics manufacturing knowledge bases have been developed for various PCBA lines and applications [6][7][8][9][10][11]. None of these studies reported an integrated PCBA process planning environment.…”

Section: Generic Overviewmentioning

confidence: 99%

Internet-based electronics manufacturing troubleshooting tool for surface mount PCB assembly

Fidan

Roush

Tumkor

et al. 2005

Int J Adv Manuf Technol

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Increasing product complexity, decreasing component size, and using double-sided boards have made surface mount technology (SMT) based electronics manufacturing (EM) components more difficult to assemble. This has resulted in the economic troubleshooting of EM defects being one of the main problems facing all manufacturers. Although the authors have made significant improvements in the EM process, it has been shown that the implemented changes in the automated lines have not yet produced a high enough percentage of reliable finished products. The objective of this current development is to make a contribution towards these EM processes by creating an Internet-based intelligent system of circuit board defect detection so that EM process flaws that necessitate rework operations can be identified prior to manufacturing runs. With the development of this system, the need to rework the defective components will be minimized for any assembly line and assembly line process parameters, which cause some reliability problems (such as solder balls, insufficient solder at joints, burnt joint connections, bridged leads, voids, skewed leads, and unformed joints) will be troubleshot directly, and the rework will be greatly reduced from the EM assembly line. This paper reports the current development and its structure.

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“…The heating method of the ovens evaluated during the times. The first reflow ovens applied pure Infra Radiation (IR) heating, so the first reflow models dealt with these [2][3][4]. These models were based on simplified expressions of heat radiation and conduction, and used only two dimensions.…”

Section: Introductionmentioning

confidence: 99%

Measuring heat transfer coefficient in convection reflow ovens

Illés

2010

Measurement

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A knowledge-based thermal profile identification advisor for surface mount PCB assembly

Abstract: Reflow soldering of solder paste is a critical process in the surface mount assembly of printed circuit boards (PCBs

Cited by 9 publications

References 8 publications

Investigating direction characteristics of the heat transfer coefficient in forced convection reflow oven

Investigating direction characteristics of the heat transfer coefficient in forced convection reflow oven

Internet-based electronics manufacturing troubleshooting tool for surface mount PCB assembly

Measuring heat transfer coefficient in convection reflow ovens

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