2008
DOI: 10.1080/10407790802182661
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A Level-Set Method for Simulation of a Thermal Inkjet Process

Abstract: A numerical approach is presented for computing a thermal inkjet process, in which bubble growth and collapse acts as a driving mechanism for ink droplet ejection. The liquid-vapor and liquid-air interfaces are tracked by a level-set method which is modified to include the effect of phase change at the liquid-vapor interface and is extended to treat the contact angle condition at an immersed solid surface. The compressibility effect of a bubble is also included in the analysis to account for the high vapor pre… Show more

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Cited by 37 publications
(15 citation statements)
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“…The mass equation (8) and the momentum equation (9) are solved by employing the projection method. We decompose Eq.…”
Section: Y Suh and G Sonmentioning
confidence: 99%
See 1 more Smart Citation
“…The mass equation (8) and the momentum equation (9) are solved by employing the projection method. We decompose Eq.…”
Section: Y Suh and G Sonmentioning
confidence: 99%
“…Also, their method was based on diffuse-interface modeling, in which the interface is treated as a transition region smoothed over several grid spacings. Suh and Son [9] extended the diffuseinterface LS method for simulation of a thermal inkjet process including bubble growth and collapse as well as ink droplet ejection. In the earlier work of Aleinov et al [10], a coupled level-set and volume-of-fluid (CLSVOF) method was developed to compute the formation of droplets in microscale jetting devices.…”
Section: Introductionmentioning
confidence: 99%
“…The step function α a is initialized for the liquid-air region and tracked by the LS function ϕ as described by Suh and Son [25].…”
Section: Numerical Analysismentioning
confidence: 99%
“…(19) implies that a near-zero level set rather than φ = 0 is used as the immobile boundary condition during the reinitialization procedure (18) . The step function α a is initialized for the air region and tracked by the LS function φ as described by Suh and Son (18) .…”
Section: Journal Of Thermal Science and Technologymentioning
confidence: 99%