A low-cure-temperature copper nano ink for highly conductive printed electrodes

Lee, Byoung-Yoon; Kim, Yoonhyun; Yang, Seungnam; Jeong, Inbum; Moon, Jooho

doi:10.1016/j.cap.2009.03.008

Cited by 117 publications

(52 citation statements)

References 15 publications

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“…Copper (1.68 · 10 À8 Xm), gold (2.44 · 10 À8 Xm) and aluminium (2.82 · 10 À8 Xm) have similar values. The high price of gold immediately discounts it from any bulk applications, and copper requires a special processing atmosphere; Moon et al reported on the inkjet printing of a copper MOD ink, which was converted in a 3%H 2 atmosphere [72]. To date, silver has been the metal that has been most reported, as it ease of processing offsets its price compared to gold and copper.…”

Section: Metallic Inksmentioning

confidence: 99%

“…The phase change typically takes the form of evaporation of carrier solvent [38-40, 44, 54, 60, 67], although can also be via solidification [47,51,56], or gelation [68,69]. Depending upon the ink system used, it may subsequently be necessary to perform further processing to achieve the desired functionality, such as thermal treatment [44,[70][71][72], electromagnetic irradiation [73][74][75], or chemical treatment [76][77][78][79][80][81].…”

Section: Droplet Behaviour On a Substratementioning

confidence: 99%

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Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

et al. 2016

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-Additive manufacturing, an umbrella term for a number of different manufacturing techniques, has attracted increasing interest recently for a number of reasons, such as the facile customisation of parts, reduced time to manufacture from initial design, and possibilities in distributed manufacturing and structural electronics. Inkjet printing is an additive manufacturing technique that is readily integrated with other manufacturing processes, eminently scalable and used extensively in printed electronics. It therefore presents itself as a good candidate for integration with other additive manufacturing techniques to enable the creation of parts with embedded electronics in a timely and cost effective manner. This review introduces some of the fundamental principles of inkjet printing; such as droplet generation, deposition, phase change and post-deposition processing. Particular focus is given to materials most relevant to incorporating structural electronics and how post-processing of these materials has been able to maintain compatibility with temperature sensitive substrates. Specific obstacles likely to be encountered in such an integration and potential strategies to address them will also be discussed.

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Section: Metallic Inksmentioning

confidence: 99%

Section: Droplet Behaviour On a Substratementioning

confidence: 99%

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

et al. 2016

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“…Oxidation can be prevented by avoiding copper to be in contact with oxygen by adding various capping agents in the formulation of the inks. [12][13][14][15] Moreover, different reduction methods were also adapted such as laser sintering [16][17][18] and calcination in nitrogen, 19 hydrogen, 20,21 and formic acid 7 atmospheres. In this study, conductive inks were prepared by forming complexes of copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC).…”

Section: Introductionmentioning

confidence: 99%

Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

Hwang¹,

Kim²,

Ayag³

et al. 2014

Bulletin of the Korean Chemical Society

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Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at 110 o C to 150 o C to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of 1.88 ·cm of copper film was obtained at 150 o C in gaseous formic acid condition. The long-term resistivity shows to increase from 1.88 ·cm to 2.61 ·cm after one month.

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“…To meet the low-temperature sintering and direct writing requirements, metallo-organic decomposition (MOD) [21][22][23][24][25] inks currently catch widespread research interests for copper metal pattern formation on plastic substrates. Among all the organic copper salts, copper formate (CuF) is the most commonly used material due to its self-reducible characteristic.…”

Section: -11mentioning

confidence: 99%

Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

et al. 2017

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In this study, a thermally triggered self-reducible copper ink is developed to print conductive patterns on flexible substrates. Inks containing only copper formate (CuF) and monoisopropanol amine (MIPA) generated large bubbles in the CuF decomposing process, and thus the surface morphologies of prepared thin films were largely disturbed. With the addition of octylamine (OA), the bubbling disturbance was relieved due to the lower surface tension and the film uniformity was greatly improved. A low resistivity of 2 Â 10 À7 U m (8.5% of bulk copper) can be reached by heating the ink at 140 C for 5 minutes under a nitrogen environment. XRD results showed the synthesized copper films were comprised of pure metallic copper crystalline. The copper films were composed of closely packed spherical grains of 50 to 500 nm in diameter. After the addition of 1 wt% polyvinylpyrrolidone (PVP) in the ink, the synthesized copper thin films showed great adhesion on glass substrates, and sustained the same conductivity after repeated tape tests.The ink can also be printed on flexible substrates, such as polyethylene terephthalate (PET) or polyimide (PI) thin films, to create highly-conductive tracks with a strong mechanical stability. Finally, various conductive patterns were printed on flexible substrates to show the great potential of this ink for various printed electronic applications. IntroductionThe recent advancements in printing technology have provided a new fabrication method for exible and light-weight electronic devices at low costs. To fabricate these so-called printed electronic devices, inks containing conductive materials are printed on plastic sheets to produce exible microelectronic circuits. As the most essential part in every circuit, electrically conductive interconnects from metal inks have been widely used in these printed devices. To reduce the manufacturing cost, copper has recently attracted wide attention for printed conductive features because of its low price, and high electric conductivity. The most commonly used copper inks are nanoparticle suspensions. 1-7 The printed patterns can yield a low resistivity down to 2.2 times of that for bulk copper 2 aer sintering at 200 C for an hour. However, most plastic substrates might melt or deform at this high temperature. Alternatively, electroless plating approach offers a low-temperature synthetic route for copper thin lm fabrication on plastic surfaces. 8-11Solutions containing active agents are rst printed with microcontact 12-14 or inkjet printing 15-20 methods to produce patterns on plastic substrates. Copper metal are then deposited selectively on the printed patterns in a subsequent electroless plating bath. 12,13,15,16,19 Although electroless plating methods can produce highly conductive copper thin lms on exible substrates at low temperatures, the method needs two processing steps and the plating uid might contaminate or modify the plastic surfaces other than the patterned area. Thus, copper inks that can directly print on selected area with l...

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A low-cure-temperature copper nano ink for highly conductive printed electrodes

Cited by 117 publications

References 15 publications

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

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