2008 International Conference on Electronic Packaging Technology &Amp; High Density Packaging 2008
DOI: 10.1109/icept.2008.4607018
|View full text |Cite
|
Sign up to set email alerts
|

A March-CL test for interconnection faults of SOC

Abstract: Shrinks of feature size, high working frequency, and rising number of the IP cores integrated in SOC make the problem with interconnection test critics. A March-CL test for interconnection faults of SOC is proposed in this article. According to the method, eight test patterns are used to detect stuck and delay faults of interconnection between IP cores. The IP connected by interconnection under test (IUT) is wrapped and complied with IEEE1500. Short test time and low area overhead are achieved with the method.… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 10 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?