7th Pulsed Power Conference
DOI: 10.1109/ppc.1989.767632
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A mechanism for surface flashover of semiconductors

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Cited by 20 publications
(10 citation statements)
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“…A simple calculation [6] shows that a uniform (nonfilamentary) heating process is unlikely to induce breakdown through thermal runaway at the surface on a time scale consistent with our results for "new" samples. For example, if heat flow out of the surface conduction layer is neglected, and a surface carrier density of 2 x 10'' cm-3 assumed, then for an applied field of 30 kV/cm and other parameters the same as the room temperature bulk values for silicon, ohmic heating would result in a rate of temperature rise of about 2.5 X 101ooC/s.…”
Section: Discussionsupporting
confidence: 87%
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“…A simple calculation [6] shows that a uniform (nonfilamentary) heating process is unlikely to induce breakdown through thermal runaway at the surface on a time scale consistent with our results for "new" samples. For example, if heat flow out of the surface conduction layer is neglected, and a surface carrier density of 2 x 10'' cm-3 assumed, then for an applied field of 30 kV/cm and other parameters the same as the room temperature bulk values for silicon, ohmic heating would result in a rate of temperature rise of about 2.5 X 101ooC/s.…”
Section: Discussionsupporting
confidence: 87%
“…This plasma may influence the course of the breakdown, but it does not appear to be the cause of the breakdown event. This evidence supports the earlier suggestion of Williams and Peterkin [6] that surface flashover might be caused by carrier accumulation at the semiconductor surface as a result of electric-field-induced band bending, and that of Thomas and Nunnally [ 101 that current filamentation in the semiconductor surface plays an important role in the process. 11.…”
Section: Introduction Here Has Been Considerable Interest Recently Insupporting
confidence: 91%
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