A MEMS high g acceleration sensor simulation analysis

Abstract

The acceleration sensor with high g value is widely used in a variety of fields, including collision impact, aerospace, and defense security and thus is a key focus in the future. The sensor with a double-ended four-beam structure is investigated in this paper via finite element simulation analysis. The measurement sensitivity of the sensor can be improved by changing the position of the cantilever beam. Furthermore, transverse interference in the X-direction and Y-direction can be eliminated in theory through the layout of piezoresistors and the Wheatstone circuit. The simulation results show that the sensor's sensitivity is 2.6μV/g while its cross-sensitivity in the X-direction and Y-direction is 0%, indicating that the sensor's performance has been substantially improved.

Multifunctional, flexible, and mechanically robust polyimide-MXene nanocomposites: a review

“…For instance, MXene/cellulose nanofibers form a 'brick-and-mortar' structure under vacuum filtration. Lightweight aerogels were obtained when the PAA/MXene mixture was first freeze-dried and then subjected to imidization [62][63][64][65][66][67][68][69][70][71]. Hybrid aerogels presented superelasticity with large reversible compressibility.…”

“…The porous film was the result of the imidization of the aerogel carried out through hot-pressing [72]. In an alternating procedure, PI aerogel/foam was dip-coated into the MXene dispersion to obtain an aerogel/foam [65,[73][74][75]. In the case of phase change composites (PCCs), polyethylene glycol (PEG) was vacuum-impregnated into the PI-MXene aerogel [76,77].…”

“…Thus, this composite presented potential in the nextgeneration multifunctional fire-protection aerogels. While Jiang et al [73] achieved a thermal insulation performance of 0.048 W m −1 K −1 , Yang et al [65] obtained a better efficiency of 0.022 W m −1 K −1 by adding GO to the PI/MXene composite. After mixing GO, MXene, and PAA, the aerogel was obtained by directional freeze-drying and subsequent imidization.…”

Simulation and experimental study of capacitive sensors for penetration fuze

“…Due to the lack of understanding of the response mechanism of penetration mechanics and accelerometer [3][4], the problems of signal collection and processing in the process of high-speed penetration can not be well solved. In the layer count (hole identification) ignition method, the traditional method uses piezoelectric or piezoresistive accelerometers to measure the high overload penetration signal, which has a wide response frequency bandwidth, a wide linear range of sensitivity, and high overload resistance [5][6][7], which measures the overload during the penetration process more accurately. However, several typical problems still occur during the measurement, such as the deceleration signal being flooded by the projectile structure response signal and noise signal, acceleration signal mixing and sticking, processing algorithm research of complex signals, and so on [8][9][10].…”

Crack Defect Detection Processing Algorithm and Method of MEMS Devices Based on Image Processing Technology

“…The modules of Micro-Electro-Mechanical-Systems (MEMS) mainly include micro-sensor, signal processing circuits and micro-actuators, etc. [1][2][3], and the size of these modules is between a few microns and a few millimeters, with the characteristics of miniaturization, high precision, high reliability and low power consumption [4][5]. Nowadays MEMS devices are widely used in aerospace, medical, military and other fields, and have important application value [6][7][8].…”