2008
DOI: 10.1016/j.mee.2008.06.018
|View full text |Cite
|
Sign up to set email alerts
|

A method to determine the sweep resistance of wire bonds for microelectronic packaging

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
8
0

Year Published

2010
2010
2022
2022

Publication Types

Select...
7
1

Relationship

2
6

Authors

Journals

citations
Cited by 20 publications
(8 citation statements)
references
References 6 publications
0
8
0
Order By: Relevance
“…For mathematical simplicity, we employ an elliptical wire bond profile to simulate the wire bond in semiconductor packaging. The similarity of wire sweep behavior between them is demonstrated to be within error variance [8], [9].…”
Section: Sag Deflection Theory For Elliptical Wire Bond Profilementioning
confidence: 87%
See 2 more Smart Citations
“…For mathematical simplicity, we employ an elliptical wire bond profile to simulate the wire bond in semiconductor packaging. The similarity of wire sweep behavior between them is demonstrated to be within error variance [8], [9].…”
Section: Sag Deflection Theory For Elliptical Wire Bond Profilementioning
confidence: 87%
“…In order to prevent this failure, the mechanical behavior of wire sweep and wire sag has to be fully investigated and understood. A comprehensive study of the empirical model of wire sweep has been proposed by us earlier [8], [9]. This paper will focus on the development of sag deflection of wire bond for semiconductor applications.…”
Section: B Special Sag Deflection Case For An L-shaped Framementioning
confidence: 99%
See 1 more Smart Citation
“…Kung in [3] for circular cross section of wire bond can be further modified and applied for ellipse cross section of wire bond to predict their sweep stiffness.…”
Section: Theoretical Model For Wire Sweep Stiffnessmentioning
confidence: 99%
“…Increasingly complex loops have been developed to meet the demands of the latest 3-D package and system-in-package requirements [1]. Looping is an interactive process between the material and the capillary trace In industry, loop design relies on many experiments to estimate loop profiles and to optimize the parameters [2], [3].…”
Section: Introductionmentioning
confidence: 99%