A micromechanical analysis to the elasto-viscoplastic behavior of solder alloys

Liu, Lu; Yao, Yao; Zeng, Tao

doi:10.1016/j.ijsolstr.2018.10.003

Cited by 19 publications

(17 citation statements)

References 47 publications

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“…With high homologous temperatures, Sn-rich solder undergoes creep at room temperature. In this work, creep was assumed to be caused by dislocation slip, with other mechanisms neglected (Liu et al.2019). Thus, creep and plastic deformation can be unified into inelastic deformation based on plasticity also caused by dislocation slip.…”

Section: Constitutive Model Frameworkmentioning

confidence: 99%

“…Representative volume element (RVE) model was used to simulate the stress-strain curves under the tensile conditions. This model has been widely used to investigate the macroscopic mechanical performance of materials from mesoscopic perspective (Hu et al., 2016; Liu et al., 2019; Wang and Jiang, 2020). Containing enough grains in RVE model is important to keep the convergence of the simulation results because the results are sensitive to the number of grains.…”

Section: Parameters Obtainingmentioning

confidence: 99%

“…Bunge Euler angle was employed to describe the grain orientation with three rotation angles. A detailed description of Bunge Euler angle can be found in the literature (Liu et al., 2019). Six simulation models of three representative single grains of (0-0-0)°, (0-45-0)°, and (0-90-0)° under two tensile conditions were established.…”

Section: Constitutive Model Verificationmentioning

confidence: 99%

“…(2007, 2008), Zamiri et al. (2009), and Liu et al. (2019) have developed anisotropic constitutive models for Sn-rich solder based on the crystal plastic theory, which argue that the anisotropic mechanical property is caused by dislocation slip along different slip planes and directions (Roters et al., 2010).…”

Section: Introductionmentioning

confidence: 99%

“…However, these linear anisotropic constitutive models are simple and unrealistic despite being important to understand the anisotropy of Sn-rich solder. Gong et al (2007Gong et al ( , 2008, Zamiri et al (2009), andLiu et al (2019) have developed anisotropic constitutive models for Sn-rich solder based on the crystal plastic theory, which argue that the anisotropic mechanical property is caused by dislocation slip along different slip planes and directions (Roters et al, 2010). However, some limitations exist in these constitutive models.…”

Section: Introductionmentioning

confidence: 99%

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Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

Zhang

Liu

et al. 2021

International Journal of Damage Mechanics

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With the rapid development of microelectronics and nanoelectronics, Moore law has significantly slowed down and More than Moore based system in packaging (SiP) is expected to be more and more important, at least for next one to two decades. Mechanical behaviors of interconnect materials such as solders are critical for yield in processes and reliability in testing and operation. Based on the framework of crystal plastic theory and continuum damage mechanics, an anisotropic constitutive model coupled with damage was developed to describe the deformation behaviors of Sn-rich solder. In the proposed model, the inelastic shear rate function was presented by hyperbolic sinusoidal form and power law form. For the damage evolution law, the total shear strain was chosen as the damage function variable. The proposed model was implemented into the general finite element software ABAQUS by forward Euler integration procedure. Some simulation examples were performed to verify the proposed model by comparing the simulation results with the experiments at uniaxial tensile conditions with SnAgCuSb solder chosen as the Sn-rich solder. The tensile stress-strain curves of the simulation results agreed well with the experiments at small strain under different temperatures and strain rates. The simulated stress-rupture stages showed reasonable accuracy with the experiments under four representative tensile conditions. Different tensile stress-strain curves of single grains with orientation of (0-0-0)°, (0-45-0)°, and (0-90-0)° were obtained under the same loading conditions, with an inverse relationship between the tensile strength and elongation. This relationship was in accordance with a referable literature. All these results indicate that the proposed model can describe the deformation behaviors of SnAgCuSb solder well under the tensile conditions in consideration of the mechanical anisotropy and the damage evolution.

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Section: Constitutive Model Frameworkmentioning

confidence: 99%