A micrometer scale and low temperature PZT thick film MEMS process utilizing an aerosol deposition method

Wang, Xuan-Yu; Lee, Chi‐Yuan; Peng, Cheng-Jien; Chen, Pei-Yen; Chang, Pei‐Zen

doi:10.1016/j.sna.2007.11.027

Cited by 49 publications

(26 citation statements)

References 24 publications

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“…Fabricating the PZT layer using an aerosol deposition method has been proven to be a quick, efficient and easy-to-pattern MEMS process [42,43]. The aerosol deposition equipment deposited PZT film up to 0.1 micrometer per minute.…”

Section: Pzt Deposition Methodsmentioning

confidence: 99%

Piezoelectric MEMS Power Generators for Vibration Energy Harvesting

Wu¹,

Lee²

2012

Small-Scale Energy Harvesting

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Section: Pzt Deposition Methodsmentioning

confidence: 99%

Piezoelectric MEMS Power Generators for Vibration Energy Harvesting

Wu¹,

Lee²

2012

Small-Scale Energy Harvesting

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“…Wang et al (27) developed the integration of bulk PZT and silicon by Cytop, a patternable bond layer, and the thinning of bulk PZT by the chemical mechanical polishing method. Bonding processes must ensure the precision of the designed structure.…”

Section: Conductive Epoxy As the Bonding Layer For Direct Bondingmentioning

confidence: 99%

“…The fabricated harvester device produces 14.0 μW with an optimal resistive load of 100 kΩ from 1g input acceleration at its resonant frequency of 235 Hz. A sintering temperature above 550 ℃ can provide high piezoelectricity, (27) which limits the application of the subsequent MEMS fabrication process. However, bulk PZT ceramics provide higher electromechanical coupling and harvesting efficiency than deposited piezoelectric thin films.…”

Section: Introductionmentioning

confidence: 99%

Piezoelectric Thick Film Based on Bonding technologies for Energy Harvester

2017

Sensors and Materials

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With the development of low-power-consumption electronic devices and systems, the development of power supplies will be a major challenge. High-performance piezoelectric energy harvesters (PEHs) are an alternative that convert mechanical deformation into electric charge. For PEHs, it is highly desirable to utilize materials with a high piezoelectric charge coefficient. Piezoelectric thick films based on bonding and thinning technologies meet this requirement due to their high-temperature sintering process. In this paper we review the development of piezoelectric thick film fabrication processes, including the direct bonding process and the transferring process. Additionally, PEHs in substrates for different applications are described. Moreover, we summarize and compare the output performance of thick-film-based PEHs from all recently published papers in terms of normalized power density and resonant frequency.

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“…In MEMS technology, most of the devices are developed using the micromachined silicon structures [1]. Combination of micromachined silicon with piezoelectric films leads to the novel microdevices [2,3].…”

Section: Introductionmentioning

confidence: 99%

Enhanced electrical properties of PZT thick films prepared by sol–gel technique through step-by-step crystallization process

Jegatheesan

Giridharan

2011

J Mater Sci: Mater Electron

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Pb(Zr x Ti 1-x )O 3 : PZT] films at morphotropic phase boundary composition (x = 0.52) were deposited on bare Si, ZrO 2 /Si and Pt/Ti/SiO 2 /Si substrates by sol-gel spin on technique. Films deposited on the bare Si and ZrO 2 / Si substrates had low degree of crystallization and micro cracks. Well crystallized films with smooth microstructure were obtained on Pt/Ti/SiO 2 /Si substrates. Further, the thickness of the films on Pt/Ti/SiO 2 /Si substrate was increased up to *1 lm by step-by-step crystallization process. The single perovskite phase of the above films was confirmed with X-ray diffraction analysis. Films had enhanced dielectric properties at room temperature and the dielectric constant values were comparable to those of bulk values at Curie temperature (T c ) from the temperature dependent dielectric measurements. Films exhibit higher remnant polarization (P r ) and lower coercive field (E c ) values. Further, capacitance-voltage (C-V), current-voltage (I-V) measurements and rough estimation of piezoelectric coefficient of the films were carried out.

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A micrometer scale and low temperature PZT thick film MEMS process utilizing an aerosol deposition method

Cited by 49 publications

References 24 publications

Piezoelectric MEMS Power Generators for Vibration Energy Harvesting

Piezoelectric MEMS Power Generators for Vibration Energy Harvesting

Piezoelectric Thick Film Based on Bonding technologies for Energy Harvester

Enhanced electrical properties of PZT thick films prepared by sol–gel technique through step-by-step crystallization process

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