A modular, high performance, 2 μm CCD-BiCMOS process technology for application specific image sensors and image sensor systems on a chip

Abstract

Ahstract -A 2 pm BiCMOS process module has been developed for incorporation into existing charge-coupled device (CCD) image sensor processes. The modular process architecture allows integration of CMOS, NPN bipolar or BiCMOS circuits without affecting the baseline CCD characteristics, and enables on-chip integration of desired analog and digital circuit functions with the image sensor. To our knowledge this is the first demonstration of high performance CCD, 2 pm CMOS, and an isolated vertical NPN integrated on the same chip.