A monolithic resonant terahertz sensor element comprising a metamaterial absorber and micro‐bolometer

Grant, James P.; Carranza, Ivonne Escorcia; Li, Chong; McCrindle, Iain J. H.; Gough, John; Cumming, David R. S.

doi:10.1002/lpor.201300087

Cited by 93 publications

(55 citation statements)

References 34 publications

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“…The dielectric insulating layers are shown in light blue and the air is shown in darker blue, hence a refractive index of 1. The absorption characteristics of the broadband MM absorber were simulated using 3D finite difference time domain (FDTD) software 8 , Lumerical Inc. The spectral response of the THz broadband metamaterial absorber is shown in Figure 2b, the simulated response showing an 88.2% absorption at 2.65 THz is shown in blue and the experimental response in red.…”

Section: Detector Designmentioning

confidence: 99%

Terahertz imagers based on metamaterial structures monolithically integrated in standard CMOS technologies

Escorcia

Grant

Gouveia

et al. 2018

Image Sensing Technologies: Materials, Devices, Systems, and Applications V

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Silicon complementary metal oxide semiconductor (CMOS) technologies are arguably the most important asset in the world of electronics. Focal plane arrays (FPAs) are one of the driving forces in the revolution of low-cost, mass produced, compact, and high-resolution imaging devices. The importance of these imaging systems in the visible spectrum has highlighted the need of their implementation into other significant electromagnetic regions such as infrared (IR) and Terahertz (THz). The unique characteristics of THz waves make them ideal for a variety of important applications ranging from security and medical imaging, explosive and drug detection, and non-destructive quality control testing. These applications are possible due to the non-ionizing nature of THz radiation, its transparency to many non-conductive materials, and distinctive spectroscopic fingerprints of a vast number of substances.Current THz imaging systems are usually restricted to laboratory use due the lack of compact, portable and roomtemperature operated sources and detectors. Therefore, the implementation of CMOS based THz detectors is key to promote the exploitation of low-cost, room-temperature, high-resolution, highly sensitive, and portable THz imaging systems. Here we present the monolithic integration of two types of THz FPAs fabricated in a standard 180 nm CMOS process. The imagers are composed of THz metamaterials (MM) absorbers coupled to a microbolometer, either vanadium oxide (VOx) or silicon pn diode, integrated with readout electronics to form 64 x 64 CMOS FPAs. The suitability of THz imagers for stand-off imaging of concealed objects was demonstrated in transmission mode by capturing images of metallic objects hidden in a manila envelope.

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Section: Detector Designmentioning

confidence: 99%

Terahertz imagers based on metamaterial structures monolithically integrated in standard CMOS technologies

Escorcia

Grant

Gouveia

et al. 2018

Image Sensing Technologies: Materials, Devices, Systems, and Applications V

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“…A vanadium oxide (VOx) micro-bolometer was integrated into each pixel by post-processing steps. We have previously reported a MM absorber integrated in a CMOS platform however in forming the membrane all of the underlying silicon was removed [19,20]. As a consequence, each pixel could not be addressed.…”

Section: Metamaterials Based Terahertz Imagingmentioning

confidence: 99%

Metamaterial-Based Terahertz Imaging

Carranza

Grant

Gough

et al. 2015

IEEE Trans. THz Sci. Technol.

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Abstract-This article presents the design of an innovative, low-cost, uncooled, metamaterial based terahertz (THz) focal plane array (FPA). A single pixel is composed of a resonant metamaterial absorber and micro-bolometer sensor integrated in a standard 180 nm CMOS process. The metamaterial is made directly in the metallic and insulating layers available in the six metal layer CMOS foundry process. THz absorption is determined by the geometry of the metamaterial absorber which can be customized for different frequencies. The initial prototype consists of a 5 x 5 pixel array with a pixel size of 30 µm x 30 µm and is readily scalable to more commercially viable array sizes. The FPA imaging capability is demonstrated in a transmission and reflection mode experiment by scanning a metallic object hidden in a manila envelope.

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“…The periodic nature of MM absorbers lends itself to coupling with micro-bolometer sensing elements to form a focal plane array (FPA). MM based FPAs have been developed in both the S band (2-4 GHz) [27] and at THz frequencies (2.5 THz) where the MM absorbers were monolithically integrated into a standard 0.35 μm CMOS process and the vanadium oxide microbolometer sensors deposited on top [30,31].…”

Section: Introductionmentioning

confidence: 99%

Multi-spectral materials: hybridisation of optical plasmonic filters, a mid infrared metamaterial absorber and a terahertz metamaterial absorber

2016

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Multi-spectral imaging systems typically require the cumbersome integration of disparate filtering materials and detectors in order to operate simultaneously in multiple spectral regions. Each distinct waveband must be detected at different spatial locations on a single chip or by separate chips optimised for each band. Here, we report on a single component that optically multiplexes visible, Mid Infrared (4.5 μm) and Terahertz (126 μm) radiation thereby maximising the spectral information density. We hybridise plasmonic and metamaterial structures to form a device capable of simultaneously filtering 15 visible wavelengths and absorbing Mid Infrared and Terahertz. Our synthetic multi-spectral component could be integrated with silicon complementary metal-oxide semiconductor technology where Si photodiodes are available to detect the visible radiation and micro-bolometers available to detect the Infrared/Terahertz and render an inexpensive, mass-producible camera capable of forming coaxial visible, Infrared and Terahertz images.

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A monolithic resonant terahertz sensor element comprising a metamaterial absorber and micro‐bolometer

Cited by 93 publications

References 34 publications

Terahertz imagers based on metamaterial structures monolithically integrated in standard CMOS technologies

Terahertz imagers based on metamaterial structures monolithically integrated in standard CMOS technologies

Metamaterial-Based Terahertz Imaging

Multi-spectral materials: hybridisation of optical plasmonic filters, a mid infrared metamaterial absorber and a terahertz metamaterial absorber

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