2008 SC - International Conference for High Performance Computing, Networking, Storage and Analysis 2008
DOI: 10.1109/sc.2008.5215912
|View full text |Cite
|
Sign up to set email alerts
|

A multi-level parallel simulation approach to electron transport in nano-scale transistors

Abstract: Physics-based simulation of electron transport in nanoelectronic devices requires the solution of thousands of highly complex equations to obtain the output characteristics of one single input voltage. The only way to obtain a complete set of bias points within a reasonable amount of time is the recourse to supercomputers offering several hundreds to thousands of cores. To profit from the rapidly increasing availability of such machines we have developed a state-of-the-art quantum mechanical transport simulato… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
9
0

Year Published

2009
2009
2011
2011

Publication Types

Select...
4
2

Relationship

4
2

Authors

Journals

citations
Cited by 9 publications
(9 citation statements)
references
References 31 publications
0
9
0
Order By: Relevance
“…The calculation of electrostatic potential and of electron and hole populations are self-consistently coupled and parallelized to reduce the simulation time [16]. The transport direction x is aligned with the 100 crystal axis where the highest BTBT probability is expected.…”
Section: Simulation Approach and Resultsmentioning
confidence: 99%
“…The calculation of electrostatic potential and of electron and hole populations are self-consistently coupled and parallelized to reduce the simulation time [16]. The transport direction x is aligned with the 100 crystal axis where the highest BTBT probability is expected.…”
Section: Simulation Approach and Resultsmentioning
confidence: 99%
“…A critical element in the model is the representation of the device in an atomistic TightBinding (TB) model [6], which understands the finite number of atoms in the structure, their local arrangement with details such as strain distribution and disorder [7,8]. A full 3D atomistic quantum transport model [9,10,11] can provide the device characteristics, however, this model is computationally time consuming [12]. Recently, a 2D top of the barrier (ToB) atomistic quantum transport model [13,14,15] has been used for speedy simulation and analysis of SiNW FET device characteristics, which provides significant insight.…”
mentioning
confidence: 99%
“…Additionally, NEMO 3-D is prepared with programmable multiple-level parallelization (Figure 3) which is similar to the tri-level parallelism in NEMO 1-D (bias-energy-momentum) [22] and fourlevel parallelism in OMEN (bias-energy-momentum-1D spatial decomposition) [23][24]. However the parallelization scheme is different in a sense that the variables involved in each level can determined depending on the application.…”
Section: Omenmentioning
confidence: 99%