A multi-technique investigation of sulfur grain boundary segregation in nickel

Allart, Marion; Christien, Frédéric; Gall, René Le; Nowakowski, Paweł; Grovenor, C.R.M.

doi:10.1016/j.scriptamat.2013.01.028

Cited by 23 publications

(10 citation statements)

References 12 publications

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“…Perhaps the most theoretically studied element in this context is sulfur [7][8][9][10][11][12]. S is predicted to readily segregate to Ni GBs and cause the embrittlement of the latter, in perfect agreement with experiment [13,14]. Systematic studies of metal and non-metal sp impurities in Ni [9,12] suggest that most of them weaken Ni GBs, with the exception of Be, B and Si, which have a strengthening influence, whereas C, Al and P have little or no effect.…”

Section: Introductionmentioning

confidence: 55%

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First-principles-aided design of a new Ni-base superalloy: Influence of transition metal alloying elements on grain boundary and bulk cohesion

2015

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Section: Introductionmentioning

confidence: 55%

“…2a both for the substitutional, E gb seg (s), and interstitial segregation, E gb seg (i), obtained using Eqs. (13) and (14), respectively. If one neglects any temperature effects (which we do in the present study), then impurity should fill up positions with lower segregation energy.…”

Section: Segregation Energies To Free Surface and Grain Boundarymentioning

confidence: 99%

First-principles-aided design of a new Ni-base superalloy: Influence of transition metal alloying elements on grain boundary and bulk cohesion

2015

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“…On the other hand, the threshold crack growth rate (calculated from Equation 1) is as low as about 2 nm s −1 at 800 °C and 2 Å s −1 at 700 °C. Those values were obtained using the following inputs: 2.6 10 cm 2 s −1 at 700 °C and 3.2 10cm 2 s −1 at 800 °C (bulk diffusion coefficient of sulphur in nickel [16,17]. The bulk diffusion coefficient of sulphur in gamma iron (instead of nickel) could be considered as well:…”

Section: Resultsmentioning

confidence: 99%

Role of Impurity Sulphur in the Ductility Trough of Austenitic Iron–Nickel Alloys

Christien

2020

Materials

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The role of impurity sulphur in the ductility trough of iron–nickel (Fe–Ni) alloys is investigated using hot tensile tests. A strong detrimental effect of some ppm levels of sulphur is demonstrated. In addition, it is shown that, in the ductility trough, material failure occurs through subcritical grain boundary crack propagation, involving dynamic embrittlement at the crack tip, due to the sulphur. Very high intergranular crack growth rates are observed. This is possible because plastic deformation accelerates the transport of sulphur to the crack tip, by several orders of magnitude, compared to normal bulk diffusion. The ductility is recovered at high strain rates, which correlates with a decrease in the sulphur concentration measured on the fracture surface. It is suggested that the main mechanism of sulphur transport is dragging by moving dislocations.

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“…Although the presence of these impurities is interesting, it also has a profound effect on the tensile and creep behavior of nanocrystalline Ni. Matsui et al considered the possibility that the increase in the hardness of nanocrystalline Ni is due to the solid solution strengthening induced by C and S [8,16,22].…”

Section: Introductionmentioning

confidence: 99%

Stress effects on stability and diffusion behavior of sulfur impurity in nickel: A first-principles study

Dong

Zhang

Liu

et al. 2014

Computational Materials Science

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a b s t r a c tA systematic investigation regarding the effect of stress on the stability and diffusion behavior of S impurity in Ni was carried out via first-principles methods. A comparison of the formation energy of S in Ni indicated that S more easily forms as a solution atom with increasing S concentration in Ni supercells, but the binding energy showed that as the concentration of S that dissolved into Ni increased, the structure became less stable. The diffusion barrier via the octahedral-tetrahedral-octahedral site path was always lower than that via the octahedral-octahedral site path. The diffusion barrier of single S decreased with increase in tensile stress. S diffusion accelerated under applied tensile stress, which was disadvantageous in suppressing S retention in Ni. These results implied that even at a low concentration, dissolved S still had a tendency of precipitating from the Ni matrix, to further increase the stability of the system.

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A multi-technique investigation of sulfur grain boundary segregation in nickel

Cited by 23 publications

References 12 publications

First-principles-aided design of a new Ni-base superalloy: Influence of transition metal alloying elements on grain boundary and bulk cohesion

First-principles-aided design of a new Ni-base superalloy: Influence of transition metal alloying elements on grain boundary and bulk cohesion

Role of Impurity Sulphur in the Ductility Trough of Austenitic Iron–Nickel Alloys

Stress effects on stability and diffusion behavior of sulfur impurity in nickel: A first-principles study

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