A multi trench analog+logic protection (M-TRAP) for substrate crosstalk prevention in a 0.25 /spl mu/m smart power platform with 100V high-side capability

Parthasarathy,; Khemka,; Zhu, Wanxue; Puchades,; Roggenbauer,; Butner,; *, Hui; Rodriquez,; Bose,

doi:10.1109/wct.2004.240347

Cited by 16 publications

(2 citation statements)

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“…In any case it is important to mention that some works have used TCAD as the main tool to develop protections for minority carriers injection in order to reduce the substrate cross-talk [3], [4]. Other options normally used to reduce the substrate parasitic couplings are based on technological modifications, like improved isolation structures or the use of Deep Trench Isolation (DTI) structures [5].…”

Section: Introductionmentioning

confidence: 99%

Substrate modeling to improve reliability of high voltage technologies

Stefanucci¹,

Buccella²,

Moursy³

et al. 2015

2015 IEEE 20th International Mixed-Signals Testing Workshop (IMSTW)

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In Smart Power ICs there is the need of new substrate models to be integrated in the design flow of power circuits. This work reports the latest results regarding the substrate modeling methodology based on three-dimensional lumped components extraction of diodes, resistors and contacts. The substrate network including lateral and vertical parasitic bipolar transistor can be automatically created from any chip layout including temperature and geometry variations. In such a way fast dc and transient analysis can be carried out in early design stages to improve reliability of high voltage ICs. Since the high variability and complexity on modern Smart Power technologies, a flexible model is required. This work discusses all the features related to technology variations. Circuit simulator results are then compared with TCAD simulations.

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Section: Introductionmentioning

confidence: 99%

Substrate modeling to improve reliability of high voltage technologies

Stefanucci¹,

Buccella²,

Moursy³

et al. 2015

2015 IEEE 20th International Mixed-Signals Testing Workshop (IMSTW)

View full text Add to dashboard Cite

show abstract

“…Other types of DTI isolation based on multi-trench [12] or trench combined with junction isolation [13] are less efficient in terms of area consumption.…”

Section: Introductionmentioning

confidence: 99%