“…Compared to mechanical joining [10], solid reaction diffusion bonding [11,12], brazing [13,14], glass bonding [15,16] and organic precursor bonding [17,18], the inorganic phosphate adhesive bonding is the fastest, cheapest, and most practical joining method, which possesses several superior properties such as room-temperature curing, low-cost production, simple preparation technology and more stable high-temperature resistance [19][20][21]. Its low temperature curing and stable heat-resistant properties make it the promising joining method characterized by ''one-time binding without post-treatment'', thus promoting the processes feasibility, especially when the fabrication and repair of components are needed to be done onsite where the heat treatment is not allowed or not easily carried out [22].…”