A multichip module integration technology for high-speed analog and digital applications

Abstract

We present a planar multichip module integration technology intended for high frequency applications. Bare dice are plclced in substrate openings and connected thru a thin film multilayer realized in LI planay fashion on top of the embedded system. lt i,c built of dielectric polymer layers and a sputtered / electroplated copper wiring on ceramic or silicon substrate.Polyimid PyralinTM (2722 (Du Pont) and are used as interlevel dielectric. Metalizu!ion is bused on a Ti: W / Cu tie layel;which is subsequently electroplated with Cu. The paper also addresses high frequency performance (of the described technology, electromagnetic jull-wave modeling and equivalent circuit model e-xtraction.