2014 International Symposium on Electromagnetic Compatibility 2014
DOI: 10.1109/emceurope.2014.6931052
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A new 3D-PICS High density Integrated Passive Device with substrate noise reduction by localized P+ guard rings: Characterization and modeling

Miled Ben Salah
1
,
Daniel Pasquet
2
,
Frédéric Voiron3
et al.
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