2021
DOI: 10.1007/s00034-020-01639-9
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A New Circuit-Level Technique for Leakage and Short-Circuit Power Reduction of Static Logic Gates in 22-nm CMOS Technology

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Cited by 18 publications
(10 citation statements)
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“…On the other hand, to examine the results more accurately, it is better to involve the other parameters in the concept of noise margin such as PDP and area consumption which are defined as the Width (nm) × number of transistors in this case. A higher value of the defined figure of merit (FoM) shows a better design [45]. In this regard, it can be seen that the proposed circuit with less PDP has the highest FoM compared to other cells.…”
Section: Simulation Setup Results and Comprehensive Analysismentioning
confidence: 99%
“…On the other hand, to examine the results more accurately, it is better to involve the other parameters in the concept of noise margin such as PDP and area consumption which are defined as the Width (nm) × number of transistors in this case. A higher value of the defined figure of merit (FoM) shows a better design [45]. In this regard, it can be seen that the proposed circuit with less PDP has the highest FoM compared to other cells.…”
Section: Simulation Setup Results and Comprehensive Analysismentioning
confidence: 99%
“…The conceptual block diagram of the proposed input controlled leakage restrainer transistor (ICLRT) 25 approach for leakage and short-circuit power reduction is depicted in Figure 3. The main idea of this technique is that in any condition of input signals there are at least two cutoff transistors between the supply voltage and the ground in standby mode.…”
Section: Proposed Circuit-level Techniquementioning
confidence: 99%
“…In active mode, leakage current (mainly produced by gate-oxide tunneling current) is reduced by gate-source voltage reduction, stack effect, and transistor width reduction. 25 To implement this method, like Figure 4A,B,E, an NMOS ICLRT is placed below the PDN and a PMOS ICLRT is located on top of the PUN for static CMOS gates that is depicted in Figure 3A.…”
Section: Proposed Circuit-level Techniquementioning
confidence: 99%
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