2000 IEEE International Symposium on Circuits and Systems. Emerging Technologies for the 21st Century. Proceedings (IEEE Cat No
DOI: 10.1109/iscas.2000.856373
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A new CMOS readout circuit for uncooled bolometric infrared focal plane arrays

Abstract: By incorporating the basic Constant Current (CC) configuration with the buffered direct injection (BDI) structure, a new readout circuit called the constant current buffered direct injection (CCBDI) is proposed for the uncooled bolometer detector FPAs. Due to the use of BDI structure, the offset is decreased and the linearity range is increase. Thus linearity, dynamic range, and uniformity are improved. An experimental chip of 64x64 CCBDI FPA readout circuit has be designed and fabricated by using 0.5 pm doubl… Show more

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Cited by 13 publications
(2 citation statements)
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“…Various methods have been studied to solve the problem of variations among bolometer resistors integrated in active and reference pixels. (11)(12)(13)(14)(15)(16)(17) Among previously reported research, the averaging pixel current adjustment technique has been used to reduce process variations among resistors. (18) However, a standard CMOS process was used to design the active and reference pixels with polysilicon resistors in previous research.…”
Section: Introductionmentioning
confidence: 99%
“…Various methods have been studied to solve the problem of variations among bolometer resistors integrated in active and reference pixels. (11)(12)(13)(14)(15)(16)(17) Among previously reported research, the averaging pixel current adjustment technique has been used to reduce process variations among resistors. (18) However, a standard CMOS process was used to design the active and reference pixels with polysilicon resistors in previous research.…”
Section: Introductionmentioning
confidence: 99%
“…If the full chip layout ( figure 3-35) is looked at, one should notice that there are four boxes, like those seen in figure 4-22, in each comer of the chip. Next, looking at one of the masks found in appendix E, there will be either a box or a cross in the comer of the mask, depending on if the mask is a positive or negative mask (also seen in figure [4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22]. By lining up the marks on the chip with those on the mask the resulting pattern will be properly aligned.…”
Section: Mask Alignmentmentioning
confidence: 99%