A new concept for using of Al-sheet as integrated substrate for one or multichip module package

Abstract

In this paper we present recent studies on the electromigration processes in Ag thin$lm parallel microstrip lines in MCM(D) structures. The basic concept is applying accelerated local drop-test of water solutions onto the surface of two adjacent lines, under a given voltage potential. These operational conditions are often met in the interconnection line buses, placed in the top assembly level of multilayered hybrid structures. The subject of investigations are MCM(D) developed on A1 -sheet carrier with internal conducting and isolating layers, produced through unique selective electrochemical anodization of Al and Ta. This technology process also enables the creation of embedded R and C passive components on the base of TaOxNI-x and Ta2Oj (or Al2O3) respectively. We propose an electrochemical deposition of AglSb alloys on the surface of AI interconnection lines and contact pads to ease the bondability and solderability in chip mounting procedures. The artiJicially created silver migrated defects andpartial shorts are investigated through the high frequency method of coupled transmission lines in order to eliminate the errors and insufficient validity of DC direct measurements.Key words: Thin film silver electromigration, Accelerated local drop-test of migration, Bondability and solderability of Ag/Sb layers, High frequency coupled transmission line measurements, Metal substrate multilayer thin film modules.